Thermal Properties | Metric | English | Comments |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Z-Axis |
Park Electrochemical Nelcote® V-376 Cyanate Ester Epoxy Prepregs, 4503 Quartz Reinforced Nelcote® V-376 is a Cyanate Ester matrix providing excellent electrical and mechanical properties for harsh aircraft, shipboard, and undersea applications for Radomes, Antenna, and Reflectors. Simp.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Z-Axis |
Park Electrochemical Nelcote® V-376 Cyanate Ester Epoxy Prepregs, 4581 Quartz Reinforced Nelcote® V-376 is a Cyanate Ester matrix providing excellent electrical and mechanical properties for harsh aircraft, shipboard, and undersea applications for Radomes, Antenna, and Reflectors. Simp.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Z-Axis |
Park Electrochemical Nelcote® V-376 Cyanate Ester Epoxy Prepregs, 581 Quartz Reinforced Nelcote® V-376 is a Cyanate Ester matrix providing excellent electrical and mechanical properties for harsh aircraft, shipboard, and undersea applications for Radomes, Antenna, and Reflectors. Simp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM E 831 |
Arlon Thermabond® R37340X008 Primerless Electronic Adhesive
(discontinued **) Liner: 1 mil FEP; Product: uncured Silicone Rubber; Carrier: 3 mil PTFE coated fiberglas |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Z-Axis |
Park Electrochemical Nelcote® V-376 Cyanate Ester Epoxy Prepregs, 7781 E-Glass Reinforced Nelcote® V-376 is a Cyanate Ester matrix providing excellent electrical and mechanical properties for harsh aircraft, shipboard, and undersea applications for Radomes, Antenna, and Reflectors. Simp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
28.9 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
LyondellBasell SEQUEL® 1780 Engineered Polyolefin Description: SEQUEL® 1780 engineered polyolefin is designed for mold-in-color or partially painted automotive exterior applications that require dimensional stability over a broad temperature ran.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 530 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 530 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
28.9 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ ED230HP Polypropylene TPO Compound Daplen™ ED230HP is a 20% mineral filled elastomer modified polypropylene compound intended for injection molding. This material has excellent balanced mechanical properties and gives a good surfac.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 40.0 - 130 °C |
28.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 00714 Melamine-Phenolic, Granular, Injection Molded PLENCO 00714 is a melamine-phenolic copolymer molding compound, offering excellent arc resistance and comparative track index values. Type ASTM D 5948 CMG, and UL recognized under component file E4.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 530 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 530 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 40.0 - 130 °C |
28.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4300 Phenolic, Granular, Compression Molded PLENCO 04300 is a heat resistant, mineral filled phenolic molding compound offering optimum cure characteristics and excellent dimensional stability. It is formulated for wiring devices and electric.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 40.0 - 130 °C |
28.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4599 Phenolic, Granular, Injection Molded PLENCO 04599 is a mineral filled, phenolic molding compound offering excellent heat resistance and dimensional stability, typically required for automotive ashtray applications. 04599 is formulated .. |
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CTE, linear | 52.0 µm/m-°C @Temperature 40.0 - 130 °C |
28.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 5482 Phenolic, Granular, Injection Molded PLENCO 05482 is an organic reinforced phenolic molding compound formulated with graphite to improve the abrasion resistance. 05482 is available in black and brown. 05482 is not recommended for elect.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 40.0 - 130 °C |
28.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 7202 Phenolic, Granular, Injection Molded PLENCO 07202 is an organic fiber reinforced phenolic molding compound, formulated to offer improved mechanical strength properties with an industrial finish. UL recognized under component file E4065.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 530 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 530 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 530 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 530 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 24.0 - 299 °C |
28.9 µin/in-°F @Temperature 75.2 - 570 °F |
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Hexcel® HexPly® F652 Bismaleimide Resin HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative process.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2103 Medium Viscosity/Low Vapor Pressure Epoxy Adhesive TRA-BOND 2103 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus im.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Covestro Bayflex® 180 Polyurethane Elastomeric RIM, 20% Mineral Filled, MDI-based 2-Component Liquid System 0.1 in. thickness. RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and offi.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 - 160 °C |
28.9 µin/in-°F @Temperature 68.0 - 320 °F |
Silicone Property; ASTM E 831 |
Arlon Thermabond® 99A90X008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | |
Atom Adhesives AA-BOND 2103 Epoxy Adhesive AA-BOND 2103 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting and impr.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2130 Medium Viscosity Epoxy Adhesive TRA-BOND 2130 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus im.. |
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CTE, linear | 52.0 µm/m-°C @Temperature 20.0 °C |
28.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 530 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 530 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | |
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula.. |