Thermal Properties | Metric | English | Comments |
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CTE, linear | 34.0 - 34.0 µm/m-°C @Temperature 40.0 - 130 °C |
18.9 - 18.9 µin/in-°F @Temperature 104 - 266 °F |
Average value: 34.0 µm/m-°C Grade Count:1 |
Overview of materials for Phenolic, Resole, Mineral/Flock Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral/Flock Filled". Each property range of values reported is minimum and maximum v.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 40.0 - 130 °C |
18.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4527 Phenolic, Granular, Injection Molded PLENCO 04527 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength, and resistance to cracking in a wet-dry environment. UL recognized under.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Devcon Brushable Ceramic - Red, Blue Epoxy Precision Repair EpoxyComments: Low-viscosity, alumina-filled, brushable epoxy compound, when applied to a 15-20 mil coating, provides a smooth, protective barrier against wear, abrasion, corrosion,.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Devcon Brushable Ceramic - White Epoxy Precision Repair EpoxyComments: Low-viscosity, alumina-filled, brushable epoxy compound, when applied to a 15-20 mil coating, provides a smooth, protective barrier against wear, abrasion, corrosion,.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Devcon Sprayable Ceramic™ Epoxy Precision Repair EpoxyComments: A sprayable ceramic-reinforced composite that can be sprayed in a manner similar to high-solid paints. Ideal for protecting pumps, paper machines, stacks, pump pads,.. |
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CTE, linear | 34.0 µm/m-°C | 18.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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CTE, linear | 34.0 µm/m-°C | 18.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-1/A Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-1/V Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
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Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Thermocomp® HF-1006 Polyamide 11, Glass Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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CTE, linear | 34.0 µm/m-°C @Temperature 20.0 °C |
18.9 µin/in-°F @Temperature 68.0 °F |
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Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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CTE, linear | 34.0 - 42.0 µm/m-°C | 18.9 - 23.3 µin/in-°F | Average value: 38.7 µm/m-°C Grade Count:3 |
Overview of materials for Thermoset Polyurethane, Liquid, Quartz Filled This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Liquid, Quartz Filled". Each property range of values reported is minimum and ma.. |