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Polymer Property : CTE, linear = 31.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
RedEye On Demand Polyphenylsulfone (PPSF), Rapid Prototyping Material
Polyphenylsulfone (PPSF) is a durable high-end thermoplastic that can be used in the toughest applications. Parts built in PPSF can handle heat near 400°F (204°C), it resists petroleum products, a..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50-7078/GY Polycarbonate, with carbon fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.Strong, stiff parts.Electrically conductive, suitable for cont..
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 133 Sn-Sb Solder Alloy
Higher tensile strength solder than #121. Particular application is joining copper tubing in refrigeration and potable water systems. Has good wettability with good long time sheer strength at 100Â..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
ASTM D696
Samyang Trirex® SF3200GNH20 Polycarbonate, Reinforced Non Halogen for Printers
PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.SF3200GNH20 is a reinforced, non-halogen grade for Printers.Applications: Office Machi..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
ISO 11359-2
Unitika A1030GFL PA6, 30% Glass Fiber Reinforced, Conditioned
Information provided by Unitika Ltd.
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
ISO 11359-2
Unitika A1030GFL PA6, 30% Glass Fiber Reinforced, Dry
Information provided by Unitika Ltd.
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
Williams Advanced Alloys WS145 Solder
All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy
TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci..
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
Trelleborg Emerson & Cuming Syntac® 350 Composite Materials Syntactic Foam
Syntac 350 foam is a rigid, high strength composite of epoxy resin and microscopic hollow glass microspheres designed specifically for fabricating thermoforming plugs and other associated tooling. ..
CTE, linear 31.0 µm/m-°C

@Temperature 50.0 - 200 °C
17.2 µin/in-°F

@Temperature 122 - 392 °F
DIN 53 752
Ensinger TECASINT 1031 Polyimide, 40% Graphite Filled (PI)
TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy
Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 323LP Epoxy
Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Hippe PAI Polyamide-imide
Particularly used where high strength in a wide range of temperature (-190°C…+260°C), high notched strength and very good dielectric properties are required. Features good chemical stability, fl..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
x direction
Arlon IsoClad 933 Non-Woven Fiberglass Reinforced PTFE
Traditional - Highest Performance, PTFE Coated Light Woven Glass Styles, Interdispersed PTFE FilmInformation provided by Arlon Materials for Electronics (MED).
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
Armstrong A-12-T Epoxy Adhesive
Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t..
CTE, linear 31.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
17.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8234G HS 44% Glass Filled PA6 (Dry)
Ultramid 8234G HS is a heat stabilized, 44% glass fiber reinforced polyamide 6 injection molding compound offering the highest level of strength, stiffness, high temperature performance and dimensio..
CTE, linear 31.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
17.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8266G HS BK-102 15/25% Glass/Mineral Filled PA6 (Dry)
Ultramid 8266G HS is a heat stabilized, 40% glass and mineral reinforced nylon 6 injection molding compound resulting in a balance of engineering properties with excellent dimensional stability, low..
CTE, linear 31.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
17.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8267G HS BK-102 15/25% Glass/Mineral Filled PA6 (Dry)
Ultramid 8267G HS BK-102 is a heat stabilized, black pigmented, 40% mineral and glass fiber reinforced nylon 6 injection molding compound. It possesses a balance of engineering properties in combin..
CTE, linear 31.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
17.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8267G HS BK-106 15/25% Glass/Mineral Filled PA6 (Dry)
Ultramid 8267G HS BK-106 is a heat stabilized, weather resistant, 40% mineral and glass fiber reinforced PA6 injection molding compound with improved UV resistance and sink mark resistance. The com..
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
TMA; ASTM E831
LNP Thermocomp® FP-VC-1003 BK8-019 Polyvinylidene Fluoride, Carbon Fiber Reinforcement  (discontinued **)
Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names..
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
TMA; ASTM E831
LNP Thermocomp® QF-1006 Polyamide 6/10 Copolymer, Glass Fiber Reinforcement  (discontinued **)
Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names..
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
ASTM D696
Solvay Specialty Polymers Torlon® 4203 Polyamide-imide (PAI)  (discontinued **)
Torlon 4203 is an unreinforced, lubricated, pigmented grade of polyamide-imide (PAI) resin for extrusion. It has the best impact resistance and greatest elongation of all the Torlon grades. Torlon P..
CTE, linear 31.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
17.2 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Nypel® 2367G HS BK 15/25% Glass/Mineral Filled PA6 (Dry)
Nypel 2367G HS BK-4 is a black pigmented, heat stabilized, 40% mineral and glass fiber reinforced injection molding compound based on recycled PA6 feedstocks. It possesses a balance of engineering ..
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
TMA; ASTM E831
LNP Thermotuf® QF-1006 HI Polyamide 6/10 Copolymer, Glass Fiber Reinforcement  (discontinued **)
Features: High Impact ResistanceForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades ..
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