Thermal Properties | Metric | English | Comments |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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RedEye On Demand Polyphenylsulfone (PPSF), Rapid Prototyping Material Polyphenylsulfone (PPSF) is a durable high-end thermoplastic that can be used in the toughest applications. Parts built in PPSF can handle heat near 400°F (204°C), it resists petroleum products, a.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50-7078/GY Polycarbonate, with carbon fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.Strong, stiff parts.Electrically conductive, suitable for cont.. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 133 Sn-Sb Solder Alloy Higher tensile strength solder than #121. Particular application is joining copper tubing in refrigeration and potable water systems. Has good wettability with good long time sheer strength at 100Â.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ASTM D696 |
Samyang Trirex® SF3200GNH20 Polycarbonate, Reinforced Non Halogen for Printers PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.SF3200GNH20 is a reinforced, non-halogen grade for Printers.Applications: Office Machi.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ISO 11359-2 |
Unitika A1030GFL PA6, 30% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ISO 11359-2 |
Unitika A1030GFL PA6, 30% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS145 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci.. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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Trelleborg Emerson & Cuming Syntac® 350 Composite Materials Syntactic Foam Syntac 350 foam is a rigid, high strength composite of epoxy resin and microscopic hollow glass microspheres designed specifically for fabricating thermoforming plugs and other associated tooling. .. |
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CTE, linear | 31.0 µm/m-°C @Temperature 50.0 - 200 °C |
17.2 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
Ensinger TECASINT 1031 Polyimide, 40% Graphite Filled (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | |
Hippe PAI Polyamide-imide Particularly used where high strength in a wide range of temperature (-190°C…+260°C), high notched strength and very good dielectric properties are required. Features good chemical stability, fl.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | x direction |
Arlon IsoClad 933 Non-Woven Fiberglass Reinforced PTFE Traditional - Highest Performance, PTFE Coated Light Woven Glass Styles, Interdispersed PTFE FilmInformation provided by Arlon Materials for Electronics (MED). |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-12-T Epoxy Adhesive Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t.. |
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CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Ultramid® 8234G HS 44% Glass Filled PA6 (Dry) Ultramid 8234G HS is a heat stabilized, 44% glass fiber reinforced polyamide 6 injection molding compound offering the highest level of strength, stiffness, high temperature performance and dimensio.. |
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CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Ultramid® 8266G HS BK-102 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8266G HS is a heat stabilized, 40% glass and mineral reinforced nylon 6 injection molding compound resulting in a balance of engineering properties with excellent dimensional stability, low.. |
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CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Ultramid® 8267G HS BK-102 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8267G HS BK-102 is a heat stabilized, black pigmented, 40% mineral and glass fiber reinforced nylon 6 injection molding compound. It possesses a balance of engineering properties in combin.. |
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CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Ultramid® 8267G HS BK-106 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8267G HS BK-106 is a heat stabilized, weather resistant, 40% mineral and glass fiber reinforced PA6 injection molding compound with improved UV resistance and sink mark resistance. The com.. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Thermocomp® FP-VC-1003 BK8-019 Polyvinylidene Fluoride, Carbon Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Thermocomp® QF-1006 Polyamide 6/10 Copolymer, Glass Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ASTM D696 |
Solvay Specialty Polymers Torlon® 4203 Polyamide-imide (PAI)
(discontinued **) Torlon 4203 is an unreinforced, lubricated, pigmented grade of polyamide-imide (PAI) resin for extrusion. It has the best impact resistance and greatest elongation of all the Torlon grades. Torlon P.. |
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CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Nypel® 2367G HS BK 15/25% Glass/Mineral Filled PA6 (Dry) Nypel 2367G HS BK-4 is a black pigmented, heat stabilized, 40% mineral and glass fiber reinforced injection molding compound based on recycled PA6 feedstocks. It possesses a balance of engineering .. |
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CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Thermotuf® QF-1006 HI Polyamide 6/10 Copolymer, Glass Fiber Reinforcement
(discontinued **) Features: High Impact ResistanceForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades .. |