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Polymer Property : CTE, linear = 19.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | X-Direction; IPC-TM-650 2.4.41 |
| Rogers Corporation LoPro™ RO4730 Antenna Grade Non-PTFE Laminate RO4730 LoPro Antenna Grade Laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. The resin systems of RO4730 dielectric materials are designed to p.. |
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| CTE, linear | 19.0 - 52.0 µm/m-°C | 10.6 - 28.9 µin/in-°F | Average value: 30.5 µm/m-°C Grade Count:29 |
| Overview of materials for Nylon 6, Glass Filled, Impact Grade This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, Glass Filled, Impact Grade". Each property range of values reported is minimum and maximum valu.. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP630 Paper Base Laminate Description: Machining grade with good electrical properties and moisture resistance. Low cold flow with good dimensional stability. Thickness Tested: 0.062", 0.125", and 0.500" |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg; TMA |
| Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with .. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 0.000 - 100 °C |
10.6 µin/in-°F @Temperature 32.0 - 212 °F |
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| Lucas-Milhaupt BRAZE 999 Commercial Grade Fine Silver Commercial grade fine silver (99.90% minimum silver) is widely used in numerous electrical, electronic, and industrial applications, such as contacts, fuse elements, lead wires, battery plated, and .. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP612 Paper Base Laminate Description: Room temperature punching and shearing grade up to .125" thick. More flexible and lower mechanical properties than NP611. Intended for applications where electrical and moisture require.. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP625 Paper Base Laminate Description: Paper phenolic grade with better moisture resistance than NP612. Requires less heat to punch and shear than NP611. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; ASTM D3386 |
| Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3500G30 Polycarbonate, 30% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Absolute Drying; ASTM-D696 |
| Toyobo GLAMIDE® T-663G50 Nylon-66 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
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| Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
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| Loctite® 3534 Glob Top Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
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| DuPont Teijin Films Melinex® ST328 Polyester Film, 1400 Gauge Melinex® ST328 is an exceptionally white, opaque film with a satin finish. It is pretreated on both surfaces to promote adhesion to a wide range of solvent-based and UV-curable graphics inks and va.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| CLAL-MSX SICLANIC S® TH3 Quenched Copper Alloy, 1/2 Hard, precipitation treated SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| CLAL-MSX SICLANIC S® TD3 Quenched Copper Alloy, 1/2 Hard SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 60.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 140 °F |
TMS2 Perkin Elmer |
| Arkema Group Orgalloy® RS 6030 Polyamide 6 Alloy 30% Glass Fiber reinforced Polyamide Alloy, Rigid grade, Nylon 6 basedMolding of Engineering PartsInformation provided by Arkema Group |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | |
| Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025GRU30 Polycarbonate, 30% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, electr.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Petlon® 3530 Semi-Crystalline PET, 30% Glass Fiber
(discontinued **) Characteristics: Excellent Electrical Properties, High Heat and Chemical ResistanceApplications: Automotive (Underhood), Appliances, Casings and HousingsProcessing: Injection Molding (Melt Temperatu.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
10.6 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
| Borealis Daplen™ KB4436 TPO Compound Daplen KB4436 is a 30% mineral and elastomer modified polypropylene compound intended for injection molding. Daplen KB4436 is a material with excellent impact/stiffness ratio. Thanks to its low the.. |
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| CTE, linear | 19.0 - 570 µm/m-°C | 10.6 - 317 µin/in-°F | Average value: 223 µm/m-°C Grade Count:49 |
| Overview of materials for Thermoset Fluoroelastomer This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Fluoroelastomer". Each property range of values reported is minimum and maximum values of appr.. |
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