Thermal Properties | Metric | English | Comments |
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CTE, linear | 158 µm/m-°C | 87.8 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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CTE, linear | 158 µm/m-°C | 87.8 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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CTE, linear | 158 µm/m-°C | 87.8 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE.. |
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CTE, linear | 158 µm/m-°C | 87.8 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |