Thermal Properties | Metric | English | Comments |
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CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | X-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 6202 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | Y-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 6202 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | Y-Direction; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 6202PR High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
Raschig Group MELOPLAS® 181.5 MF Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. Very good electrical properties, high surface hardness, good mechanical strength, high UV and heat resis.. |
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CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
Raschig Group MELOPLAS® 182 MF Wood flour-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in dark colors. Improved dimensional stability and electrical properties as compared with MP 180, high surf.. |
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CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
Raschig Group MELOPLAS® 183 MF Cellulose-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in white and colored shades. Improved dimensional stability and electrical properties as compared with MP 18.. |
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CTE, linear | 15.0 - 24.0 µm/m-°C | 8.33 - 13.3 µin/in-°F | Average value: 22.9 µm/m-°C Grade Count:10 |
Overview of materials for Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled". Each property range of values report.. |
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CTE, linear | 15.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.33 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis |
Industrial Laminates/Norplex NP841 Glass Fabric
(discontinued **) Description: Woven glass fabric with phenolic resin. Contains Kocite® for controlled conductivity. Acts as static electricity drain to protect electrical and electronic equipment.Thickness Tested: .. |
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CTE, linear | 15.0 - 71.0 µm/m-°C | 8.33 - 39.4 µin/in-°F | Average value: 35.3 µm/m-°C Grade Count:29 |
Overview of materials for Nylon 66, Glass Fiber Filled, Flame Retardant This property data is a summary of similar materials in the MatWeb database for the category "Nylon 66, Glass Fiber Filled, Flame Retardant". Each property range of values reported is minimum and ma.. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy Good low melting point solder for electronics assembly of for applications where Cd and Pb are to be avoided, and for thermo-electric applications. Shear rate sensitive.Information provided by the m.. |
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CTE, linear | 15.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.33 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
Industrial Laminates/Norplex NP509 Glass Fabric Description: Woven glass fabric, melamine resin laminate. Very hard, flame resistant, machining grade with excellent electrical properties in high humidity conditions. High physical strength and exc.. |
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CTE, linear | 15.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.33 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
Industrial Laminates/Norplex NP634 Laminate Description: Warm punching, composite grade with woven glass covers for improved flexural, tensile and impact strength. Electrical properties comparable to NP611.Thickness Tested: 0.062", 0.125" and.. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 - 100 °C |
8.33 µin/in-°F @Temperature 68.0 - 212 °F |
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Special Metals BRIGHTRAY® Alloy F Electrical Resistance Alloy A nickel-iron-chromium electrical-resistance alloy for use at temperatures up to 1920°F (1050°C) under continuous operating conditions. Its high iron content and relatively low level of nicke.. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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Cosmic Plastics K77 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Covestro Baydur® STR/C-410 IMR Polyurethane Composite SRIM Foam, 60% Glass Filled, MDI-based 2-Component Liquid System Contains continuous strand fiberglass mat.0.126 in. thickness.Information provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer .. |
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CTE, linear | 15.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
8.33 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6600 GV 40 HWCP 40% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 15.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
8.33 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6600 GV 45 HWCP 45% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Nickel 271 Super Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Nickel 272 Super Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Nickel Alloy 99 All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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California Fine Wire Stablohm 875 Chromium, Aluminum, and Iron Resistance Wire All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | |
Atom Adhesives AA-CARB 61 Epoxy Adhesive AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me.. |
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CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | |
Atom Adhesives AA-DUCT 903 Epoxy Adhesive AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha.. |
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CTE, linear | 15.0 - 25.0 µm/m-°C | 8.33 - 13.9 µin/in-°F | VDE 0304T1 |
Bulk Molding Compounds tetra-DUR F 4401 Bulk Molding Compound UL-licensed, general purpose productTypical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prot.. |
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CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
Raschig Group MELOPLAS® 180 MF Wood flour-reinforced, phenol-modified MF molding compound (MPF) in dark colors. High surface hardness, good mechanical strength and electrical properties, good heat resistance. Self-extinguishing .. |
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CTE, linear | 15.0 - 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
8.33 - 29.4 µin/in-°F @Temperature 104 - 266 °F |
Average value: 29.6 µm/m-°C Grade Count:12 |
Overview of materials for Melamine-Phenolic Copolymer This property data is a summary of similar materials in the MatWeb database for the category "Melamine-Phenolic Copolymer". Each property range of values reported is minimum and maximum values of ap.. |
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CTE, linear | 15.0 - 59.4 µm/m-°C | 8.33 - 33.0 µin/in-°F | Average value: 24.1 µm/m-°C Grade Count:14 |
Overview of materials for Polyethylene Terephthalate (PET), Glass/Mineral Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethylene Terephthalate (PET), Glass/Mineral Reinforced". Each property range of values reported is m.. |