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Polymer Property : CTE, linear = 15.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 15.0 µm/m-°C
8.33 µin/in-°F
X-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
Rogers Corporation RT/duroid® 6202 High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
CTE, linear 15.0 µm/m-°C
8.33 µin/in-°F
Y-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
Rogers Corporation RT/duroid® 6202 High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
CTE, linear 15.0 µm/m-°C
8.33 µin/in-°F
Y-Direction; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41
Rogers Corporation RT/duroid® 6202PR High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
CTE, linear 15.0 - 35.0 µm/m-°C

@Temperature 50.0 - 100 °C
8.33 - 19.4 µin/in-°F

@Temperature 122 - 212 °F
ISO 11359-2
Raschig Group MELOPLAS® 181.5 MF
Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. Very good electrical properties, high surface hardness, good mechanical strength, high UV and heat resis..
CTE, linear 15.0 - 35.0 µm/m-°C

@Temperature 50.0 - 100 °C
8.33 - 19.4 µin/in-°F

@Temperature 122 - 212 °F
ISO 11359-2
Raschig Group MELOPLAS® 182 MF
Wood flour-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in dark colors. Improved dimensional stability and electrical properties as compared with MP 180, high surf..
CTE, linear 15.0 - 35.0 µm/m-°C

@Temperature 50.0 - 100 °C
8.33 - 19.4 µin/in-°F

@Temperature 122 - 212 °F
ISO 11359-2
Raschig Group MELOPLAS® 183 MF
Cellulose-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in white and colored shades. Improved dimensional stability and electrical properties as compared with MP 18..
CTE, linear 15.0 - 24.0 µm/m-°C
8.33 - 13.3 µin/in-°F
Average value: 22.9 µm/m-°C Grade Count:10
Overview of materials for Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled". Each property range of values report..
CTE, linear 15.0 µm/m-°C

@Thickness 1.57 mm,
Temperature 20.0 °C
8.33 µin/in-°F

@Thickness 0.0620 in,
Temperature 68.0 °F
x-axis
Industrial Laminates/Norplex NP841 Glass Fabric  (discontinued **)
Description: Woven glass fabric with phenolic resin. Contains Kocite® for controlled conductivity. Acts as static electricity drain to protect electrical and electronic equipment.Thickness Tested: ..
CTE, linear 15.0 - 71.0 µm/m-°C
8.33 - 39.4 µin/in-°F
Average value: 35.3 µm/m-°C Grade Count:29
Overview of materials for Nylon 66, Glass Fiber Filled, Flame Retardant
This property data is a summary of similar materials in the MatWeb database for the category "Nylon 66, Glass Fiber Filled, Flame Retardant". Each property range of values reported is minimum and ma..
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy
Good low melting point solder for electronics assembly of for applications where Cd and Pb are to be avoided, and for thermo-electric applications. Shear rate sensitive.Information provided by the m..
CTE, linear 15.0 µm/m-°C

@Thickness 1.57 mm,
Temperature 20.0 °C
8.33 µin/in-°F

@Thickness 0.0620 in,
Temperature 68.0 °F
x-axis; IPC-TM 650-2.4.24
Industrial Laminates/Norplex NP509 Glass Fabric
Description: Woven glass fabric, melamine resin laminate. Very hard, flame resistant, machining grade with excellent electrical properties in high humidity conditions. High physical strength and exc..
CTE, linear 15.0 µm/m-°C

@Thickness 1.57 mm,
Temperature 20.0 °C
8.33 µin/in-°F

@Thickness 0.0620 in,
Temperature 68.0 °F
x-axis; IPC-TM 650-2.4.24
Industrial Laminates/Norplex NP634 Laminate
Description: Warm punching, composite grade with woven glass covers for improved flexural, tensile and impact strength. Electrical properties comparable to NP611.Thickness Tested: 0.062", 0.125" and..
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 - 100 °C
8.33 µin/in-°F

@Temperature 68.0 - 212 °F
Special Metals BRIGHTRAY® Alloy F Electrical Resistance Alloy
A nickel-iron-chromium electrical-resistance alloy for use at temperatures up to 1920°F (1050°C) under continuous operating conditions. Its high iron content and relatively low level of nicke..
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
Cosmic Plastics K77 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Covestro Baydur® STR/C-410 IMR Polyurethane Composite SRIM Foam, 60% Glass Filled, MDI-based 2-Component Liquid System
Contains continuous strand fiberglass mat.0.126 in. thickness.Information provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer ..
CTE, linear 15.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
8.33 µin/in-°F

@Temperature 73.4 - 176 °F
DIN 53752
CP-Polymer-Technik Wellamid® 6600 GV 40 HWCP 40% Glass Fiber Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear 15.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
8.33 µin/in-°F

@Temperature 73.4 - 176 °F
DIN 53752
CP-Polymer-Technik Wellamid® 6600 GV 45 HWCP 45% Glass Fiber Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
California Fine Wire Nickel 271 Super Alloy
All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire.
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
California Fine Wire Nickel 272 Super Alloy
All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire.
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
California Fine Wire Nickel Alloy 99
All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire.
CTE, linear 15.0 µm/m-°C

@Temperature 20.0 °C
8.33 µin/in-°F

@Temperature 68.0 °F
California Fine Wire Stablohm 875 Chromium, Aluminum, and Iron Resistance Wire
All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire.
CTE, linear 15.0 µm/m-°C
8.33 µin/in-°F
Atom Adhesives AA-CARB 61 Epoxy Adhesive
AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me..
CTE, linear 15.0 µm/m-°C
8.33 µin/in-°F
Atom Adhesives AA-DUCT 903 Epoxy Adhesive
AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha..
CTE, linear 15.0 - 25.0 µm/m-°C
8.33 - 13.9 µin/in-°F
VDE 0304T1
Bulk Molding Compounds tetra-DUR F 4401 Bulk Molding Compound
UL-licensed, general purpose productTypical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prot..
CTE, linear 15.0 - 35.0 µm/m-°C

@Temperature 50.0 - 100 °C
8.33 - 19.4 µin/in-°F

@Temperature 122 - 212 °F
ISO 11359-2
Raschig Group MELOPLAS® 180 MF
Wood flour-reinforced, phenol-modified MF molding compound (MPF) in dark colors. High surface hardness, good mechanical strength and electrical properties, good heat resistance. Self-extinguishing ..
CTE, linear 15.0 - 53.0 µm/m-°C

@Temperature 40.0 - 130 °C
8.33 - 29.4 µin/in-°F

@Temperature 104 - 266 °F
Average value: 29.6 µm/m-°C Grade Count:12
Overview of materials for Melamine-Phenolic Copolymer
This property data is a summary of similar materials in the MatWeb database for the category "Melamine-Phenolic Copolymer". Each property range of values reported is minimum and maximum values of ap..
CTE, linear 15.0 - 59.4 µm/m-°C
8.33 - 33.0 µin/in-°F
Average value: 24.1 µm/m-°C Grade Count:14
Overview of materials for Polyethylene Terephthalate (PET), Glass/Mineral Reinforced
This property data is a summary of similar materials in the MatWeb database for the category "Polyethylene Terephthalate (PET), Glass/Mineral Reinforced". Each property range of values reported is m..
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