Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 148 µm/m-°C @Temperature 20.0 °C |
82.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Spartech CastAlloy Weatherable Sheet Description: Weatherable SheetInformation provided by Spartech. |
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CTE, linear | 148 µm/m-°C | 82.2 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th.. |
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CTE, linear | 148 µm/m-°C | 82.2 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo.. |
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CTE, linear | 148 µm/m-°C | 82.2 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
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CTE, linear | 148 µm/m-°C | 82.2 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |