Thermal Properties | Metric | English | Comments |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3003 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits: |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3006 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits: |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3010 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits: |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3203 Woven-Glass Reinforced PTFE Laminate Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3206 Woven-Glass Reinforced PTFE Laminate Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RO3210 Woven-Glass Reinforced PTFE Laminate Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowTight dielectric constant and thickness control for repeatable circuit performanceLow moi.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight .. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 6202 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Rogers Corporation RT/duroid® 6202PR High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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Decomposition Temperature | 500 °C | 932 °F | ASTM D3850 |
Rogers Corporation RO3730 Antenna Grade Laminate RO3730™ Laminates have the excellent thermo-mechanical properties and electrical characteristics that antenna designers need. The laminates have a dielectric constant of 3.0 and a loss tangent of.. |
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Decomposition Temperature | 500 °C | 932 °F | |
DuPont™ Kevlar® 149 Fiber, diam. 12 µm Applications: armor, belts, hoses, composite structures, cable sheathing, gaskets, brake pads, clutch linings, friction pads, slot insulation, phase barrier insulation, interturn insulation.KEVLAR®.. |
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Decomposition Temperature | >= 500 °C | >= 932 °F | |
Dow SiLK™ Y 120 Semiconductor Dielectric Resin SiLK™ Y 120 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow |
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Decomposition Temperature | >= 500 °C | >= 932 °F | |
Dow SiLK™ Y 250 Semiconductor Dielectric Resin SiLK™ Y 250 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow |
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Decomposition Temperature | >= 500 °C | >= 932 °F | |
Dow SiLK™ Y 80 Semiconductor Dielectric Resin SiLK™ Y 80 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow |
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Decomposition Temperature | >= 500 °C | >= 932 °F | 5 percent; IPC TM-650 2.4.24.6 |
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance.. |
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Decomposition Temperature | >= 500 °C | >= 932 °F | Onset; IPC TM-650 2.4.24.6 |
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance.. |
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Decomposition Temperature | 500 °C | 932 °F | Onset; IPC TM-650 2.4.24.6 |
Arlon AD300C Commercial Microwave and RF Laminate Material Excellent Thermal Coefficient of Dielectric Constant (TCEr = -25 ppm/°C)Excellent PIM performanceHigh Thermal Conductivity ideal for Higher Power DesignsReduced Coefficient of Thermal Expansion in .. |
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Decomposition Temperature | >= 500 °C | >= 932 °F | 5 percent; IPC TM-650 2.4.24.6 |
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist.. |
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Decomposition Temperature | >= 500 °C | >= 932 °F | Onset; IPC TM-650 2.4.24.6 |
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist.. |