Thermal Properties | Metric | English | Comments |
---|---|---|---|
Decomposition Temperature | 434 °C | 813 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |