Thermal Properties | Metric | English | Comments |
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Decomposition Temperature | 389 °C | 732 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for.. |
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Decomposition Temperature | 389 °C | 732 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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Decomposition Temperature | 389 °C | 732 °F | 5 percent; IPC TM-650 2.4.24.6 |
Arlon 33N Polyimide Laminate and Prepreg High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with fla.. |