Thermal Properties | Metric | English | Comments |
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Decomposition Temperature | 311 °C | 592 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Decomposition Temperature | 311 °C | 592 °F | Onset; IPC TM-650 2.3.41 |
Arlon 38N High Performance Polyimide Low-Flow 38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow.. |