Thermal Properties | Metric | English | Comments |
---|---|---|---|
Decomposition Temperature | 519 °C | 966 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400.. |