Thermal Properties | Metric | English | Comments |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group DECAL® 1760 Phenolic Glass-fiber reinforced phenolic molding compound. Very good electrical properties, good chemical resistance and mechanical properties. This product meets the allowed upper limits for heavy metals an.. |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati.. |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on .. |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group EPOXIDUR® 3581 T-1 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very .. |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group RESINOL® 87120 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets .. |
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Deflection Temperature at 8.0 MPa | 160 - 180 °C | 320 - 356 °F | ISO 75-C |
Raschig Group RESINOL® 400 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets .. |
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Deflection Temperature at 8.0 MPa | 115 - 180 °C | 239 - 356 °F | Average value: 144 °C Grade Count:5 |
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr.. |