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Polymer Property : UL RTI, Mechanical without Impact = 302 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| UL RTI, Mechanical without Impact | 150 °C | 302 °F | UL 746B |
| SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | UL 746B |
| SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer (Asia Pacific) XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | |
| Resinoid 7051 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
UL746B |
| Covestro Apec® DP9-9373 High-Heat Polycarbonate, General Purpose, UV-Stabilized
(discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | UL 746B |
| SABIC Innovative Plastics Lexan® XHT4141 PC Copolymer (Asia Pacific) XHT4141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | UL 746 |
| Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified)
(discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
(ALL) |
| Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
(BN, BK) |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.63 mm |
302 °F @Thickness 0.0642 in |
|
| Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plenco 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok 5000 is the replacement material for the former Union Carbide BMM-5000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding performance and preheating cha.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plenco 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok 7000 is the replacement material for the former Union Carbide BMM-7000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding and preheating characteristics.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
| Plenco 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok 306 is a two-stage, mineral and flock-filled phenolic molding compound designed to have the heat resistant characteristics of Plaslok 504, while at the same time, improved impact strength.Da.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plenco 5314 Black (INJ) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
| Plenco 7021 Black Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok 7021 is the replacement material for the former Union Carbide BMRS-7021. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.60 mm |
302 °F @Thickness 0.0630 in |
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| Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 201 is a two-stage, woodflour and min.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.63 mm |
302 °F @Thickness 0.0642 in |
|
| Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled .. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | 1.60 mm |
| Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.60 mm |
302 °F @Thickness 0.0630 in |
|
| Plaslok 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | |
| Haysite Ultratrac® H950 Glass Reinforced Polyester Sheet, Electrical Grade (GPO3) This new generation of high performance material meets or exceeds all requirements for NEMA GPO-2 or GPO-3. ULTRATRAC ® H950 is recognized by U.L. as a 94V-0 material and offers greater arc and t.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | E54153 |
| Arlon 32980R015 0.015" (0.381 mm) Uncured Silicon Rubber on Polyester Film Carrier Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: Polyester FilmProduct Use: Flexible heater substrateAppearance: Red colored, high viscosity gum on polymer liners.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | |
| Arlon 44981R015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Style 1165 FiberglassSide 2: Uncured Silicone Rubber Interleave 2: Polyethylene UL Recognition File: E54153.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | |
| Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 0.750 mm |
302 °F @Thickness 0.0295 in |
BK |
| Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 0.750 mm |
302 °F @Thickness 0.0295 in |
BK |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for .. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
|
| Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
| Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock.. |
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| UL RTI, Mechanical without Impact | 150 °C @Thickness 3.00 mm |
302 °F @Thickness 0.118 in |
ALL |
| Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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| UL RTI, Mechanical without Impact | 150 °C | 302 °F | 1.57 mm |
| Plaslok 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 204 is a two-stage, woodflour and min.. |
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