Thermal Properties | Metric | English | Comments |
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CTE, linear | 53.0 µm/m-°C @Temperature 200 - 300 °C |
29.4 µin/in-°F @Temperature 392 - 572 °F |
DIN 53 752 |
Ensinger TECASINT 1011 Polyimide (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 26.0 °C |
29.4 µin/in-°F @Temperature 78.8 °F |
DIN 53752 |
BASF Ultrason S 2010 PSU Ultrason S 2010 is an unreinforced, medium viscosity standard injection molding PSU grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req.. |
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CTE, linear | 53.0 µm/m-°C @Temperature -50.0 - 30.0 °C |
29.4 µin/in-°F @Temperature -58.0 - 86.0 °F |
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3M Scotch-Weld™ 2158 B/A Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2158 B/A is a gray, two-part, high strength adhesive that chemically cures at room temperature. It has good adhesion to a variety of substrates including metals, ma.. |
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CTE, linear | 53.0 µm/m-°C @Temperature <=77.0 °C |
29.4 µin/in-°F @Temperature <=171 °F |
below Tg |
Resinlab® EP11HT Gray Filled Epoxy Adhesive Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa.. |
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CTE, linear | 53.0 µm/m-°C @Temperature <=34.0 °C |
29.4 µin/in-°F @Temperature <=93.2 °F |
below Tg |
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit.. |