Thermal Properties | Metric | English | Comments |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8 µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Murinit® SP Polyphenylene Sulfide Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8 µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Murylon® A GF Nylon 66, Glass Reinforced Murylon® A’s impressive characteristics are enhanced with admixed glass fibers. This results in a clear improvement in cold flow behavior and dimensional stability, enabling higher static pressure.. |
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CTE, linear | 50.0 µm/m-°C @Temperature -55.0 - 280 °C |
27.8 µin/in-°F @Temperature -67.0 - 536 °F |
Z Direction, 4.0 mil thickness; IPC-TM-650 2.4.41 |
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 50.0 - 155 °C |
27.8 µin/in-°F @Temperature 122 - 311 °F |
Z-Axis Alpha 1; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 100 °C |
27.8 µin/in-°F @Temperature 73.4 - 212 °F |
ASTM E831 |
Quadrant EPP Ketron® 1000 LSG PEEK, Biocompatibility tested (ISO Product Data Sheet) KETRON® PEEK LSG natural / black stock shapes are produced from batches of Victrex PEEK. This material exhibits a unique combination of mechanical properties, temperature and chemical resistance. .. |
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CTE, linear | 50.0 µm/m-°C @Temperature -55.0 - 280 °C |
27.8 µin/in-°F @Temperature -67.0 - 536 °F |
Z Direction; IPC-TM-650 2.4.41 |
Rogers Corporation RO4450F Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 50.0 - 155 °C |
27.8 µin/in-°F @Temperature 122 - 311 °F |
Z-Axis Alpha 1; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® N4000-7 FR-4 Epoxy Laminate and Prepreg The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 100 °C |
27.8 µin/in-°F @Temperature 73.4 - 212 °F |
ASTM E831 |
Quadrant EPP Ketron® LSG PEEK-CLASSIX Biocompatibility tested (ASTM Product Data Sheet) KETRON® PEEK-CLASSIX LSG white stock shapes are produced from Invibio® PEEK-CLASSIX White resin. This material exhibits a unique combination of mechanical properties, temperature and chemical re.. |
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CTE, linear | 50.0 µm/m-°C @Temperature <=143 °C |
27.8 µin/in-°F @Temperature <=289 °F |
Average below Tg; ASTM D696 |
Victrex® PEEK 650CA30 30% Carbon Fiber Filled, PolyEtherEtherKetone High performance thermoplastic material, 30% carbon fiber reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding and extrusion, low flow, FDA food contact compliant.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 30.0 - 100 °C |
27.8 µin/in-°F @Temperature 86.0 - 212 °F |
ASTM E831 |
3M Dyneon™ CC605 PTFE 25% Fiberglass Filled
(discontinued **) Product Form: White, pelletized free-flowing powder. Applications include bearings, valve seats, seals.Data provided by Dyneon. |
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CTE, linear | 50.0 µm/m-°C @Temperature <=150 °C |
27.8 µin/in-°F @Temperature <=302 °F |
ISO E 831 |
Wolf Kunststoff ZEDEX® ZX-530EL3 066 Polymer Alloy, Carbon Fiber Reinforced Main Characteristics: Low thermal expansion; High rigidity; High yield stress; High wear resistance; Low friction; Stress ResistantApplications: Chemical Engineering; Laboratory Technology; Automitv.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 25.0 - 100 °C |
27.8 µin/in-°F @Temperature 77.0 - 212 °F |
Vertical; ASTM D696 |
Unitika UNILATE® 1 NC PET Flame resisting gradeUNILATE® products are plate materials prepared by using a polyethylene terephthalate (PET resin) as the main component, blending it with glass staple fiber, inorganic filler, a.. |
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CTE, linear | 50.0 µm/m-°C @Temperature -26.0 °C |
27.8 µin/in-°F @Temperature -14.8 °F |
DIN 53752 |
BASF Ultrason E 2010 PES Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8 µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Murpec® Polyetheretherketone In comparison with other thermoplastics, Murpec® has an exceptionally low thermal expansion coefficient. This property provides optimum dimensional stability and means that dimensions do not change.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
Estimated by MatWeb from similar grades |
EVALCA EVAL® EF-F Ethylene Vinyl Alcohol Copolymer Film
(discontinued **) 32 mol % Ethylene. Non oriented type film; property values for 15 µm film.Data provided by EVALCA. Applications: EVOH is used in packaging applications because of its outstanding gas barrier pro.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 0.000 - 150 °C |
27.8 µin/in-°F @Temperature 32.0 - 302 °F |
X-Direction; IPC-TM-650 2.4.41 |
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 0.000 - 150 °C |
27.8 µin/in-°F @Temperature 32.0 - 302 °F |
Y-Direction; IPC-TM-650 2.4.41 |
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 0.000 - 150 °C |
27.8 µin/in-°F @Temperature 32.0 - 302 °F |
Z-Direction; IPC-TM-650 2.4.41 |
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t.. |
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CTE, linear | 50.0 µm/m-°C @Temperature <=143 °C |
27.8 µin/in-°F @Temperature <=289 °F |
Average below Tg; ISO 11359 |
Victrex® PEEK 450GL15 Polyetheretherketone, 15% Glass Fibre Reinforced Product Description:High performance thermoplastic material, 15% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, F.. |