Thermal Properties | Metric | English | Comments |
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CTE, linear | 40.0 µm/m-°C @Temperature <=143 °C |
22.2 µin/in-°F @Temperature <=289 °F |
Average below Tg; ISO 11359 |
Victrex® PEEK 450CA30 30% Carbon Fiber Reinforced General purpose, 30% carbon fiber reinforced, pelletized grade for injection molding.Information provided by Victrex. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=143 °C |
22.2 µin/in-°F @Temperature <=289 °F |
Average below Tg; ISO 11359 |
Victrex® PEEK 90CA30 Polyetheretherketone, 30% Carbon Fibre Reinforced Product Description:High performance thermoplastic material, 30% carbon fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food cont.. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=143 °C |
22.2 µin/in-°F @Temperature <=289 °F |
Average below Tg; ISO 11359 |
Victrex® PEEK 90HMF20 Polyetheretherketone (PEEK), 20% Carbon Fiber Reinforced Product Description: High performance thermoplastic material, 20% carbon fiber reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding, very easy flow, color black.T.. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=162 °C |
22.2 µin/in-°F @Temperature <=324 °F |
Average below Tg; ISO 11359 |
Victrex® ST™ ST45CA30 PolyEtherKetoneEtherKetoneKetone, 30% Carbon Fibre Reinforced Product Description:High performance thermoplastic material, 30% carbon fibre reinforced PolyEtherKetoneEtherKetoneKetone (PEKEKK), semi crystalline, granules for injection moulding, standard flow, .. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=162 °C |
22.2 µin/in-°F @Temperature <=324 °F |
Average below Tg; ISO 11359 |
Victrex® ST™ ST45GL30 Polyetherketoneetherketoneketone (PEKEKK), 30% Glass Fiber Reinforced Product Description:High performance thermoplastic material, 30% glass fibre reinforced PolyEtherKetoneEtherKetoneKetone (PEKEKK), semi crystalline, granules for injection moulding, standard flow, c.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 0.000 - 250 °C |
22.2 µin/in-°F @Temperature 32.0 - 482 °F |
average, in "c" direction |
Momentive Performance Materials Boralloy® PBN Pyrolytic Boron Nitride Boralloy® Pyrolytic Boron Nitride (PBN) is an anisotropic, high-temperature ceramic which exhibits a unique combination of high electrical resistance and good thermal conductivity. This non-toxi.. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=100 °C |
22.2 µin/in-°F @Temperature <=212 °F |
ISO E 830 |
Wolf Kunststoff ZEDEX® ZX-410 A4A Polymer Alloy ZX-410 is a bearing material with excellent properties and a very affordable price.Main Characteristics: Hard, Stiff, Tough; High dimensional stability; High chemical resistance; High water resistan.. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=100 °C |
22.2 µin/in-°F @Temperature <=212 °F |
ISO E 830 |
Wolf Kunststoff ZEDEX® ZX-750V5T A9T Polymer Alloy Main Characteristics: Hard; Stiff; Tough; High dimensional stability; High fatigue strength; High weather resistance; Good fire behavior; Suitable for vacuum; Good machinability; Contains PTFE; Stre.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 25.0 - 100 °C |
22.2 µin/in-°F @Temperature 77.0 - 212 °F |
Vertical; ASTM D696 |
Unitika UNILATE® 1 PC PET Standard gradeUNILATE® products are plate materials prepared by using a polyethylene terephthalate (PET resin) as the main component, blending it with glass staple fiber, inorganic filler, and othe.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 100A Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 200FPC Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thickn.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 300A Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 200 - 300 °C |
22.2 µin/in-°F @Temperature 392 - 572 °F |
25 µm film |
DuPont™ Kapton® 300HN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 300ZT Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 200 - 300 °C |
22.2 µin/in-°F @Temperature 392 - 572 °F |
25 µm film |
DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 500ZT Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available .. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 50FPC Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 200 - 300 °C |
22.2 µin/in-°F @Temperature 392 - 572 °F |
25 µm film |
DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 50VN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 200 - 300 °C |
22.2 µin/in-°F @Temperature 392 - 572 °F |
DIN 53 752 |
Ensinger TECASINT 3032 Polyimide, Black, 40% Graphite (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 250 °C |
22.2 µin/in-°F @Temperature 482 °F |
Value for Kapton® HN |
DuPont™ Kapton® 200ZT Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available in.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 23.0 - 100 °C |
22.2 µin/in-°F @Temperature 73.4 - 212 °F |
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Murtfeldt Murpec® SP Polyetheretherketone Modified Murpec® SP provides excellent slide properties in addition to good mechanical properties. Murpec® SP also offers improved wear behavior due to its special additives.Special Properties:• .. |
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CTE, linear | 40.0 µm/m-°C @Temperature 200 - 300 °C |
22.2 µin/in-°F @Temperature 392 - 572 °F |
25 µm film |
DuPont™ Kapton® 200HN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General .. |
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CTE, linear | 40.0 µm/m-°C @Temperature <=103 °C |
22.2 µin/in-°F @Temperature <=217 °F |
below Tg |
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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CTE, linear | 40.0 µm/m-°C @Temperature 20.0 °C |
22.2 µin/in-°F @Temperature 68.0 °F |
In machine direction. |
Chevron Phillips Ryton® R-4 04 PPS (Polyphenylene Sulfide)
(discontinued **) Ryton® PPS is used in many electronic and automotive applications because of its high strength, favorable electrical properties, and high temperature stability.Data provided by the manufacturer.Sol.. |