Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 31.0 µm/m-°C @Temperature <=132 °C |
17.2 µin/in-°F @Temperature <=270 °F |
below Tg |
Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
|||
CTE, linear | 31.0 µm/m-°C @Temperature 0.000 - 100 °C |
17.2 µin/in-°F @Temperature 32.0 - 212 °F |
X-Direction; IPC-TM-650 2.4.41 |
Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to.. |
|||
CTE, linear | 31.0 µm/m-°C @Temperature 50.0 - 200 °C |
17.2 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
Ensinger TECASINT 3032 Polyimide, Black, 40% Graphite (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |