Polymer Property : CTE, linear = 11.1 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4828 High Temperature Austenitic Stainless Steel Standardized high temperature steel for service at temperatures of up to 950-1000°C in dry air. Utilization in the temperature range of 600-900°C can lead to embrittlement.Applications: Heat and ..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4841 High Temperature Austenitic Stainless Steel Variant of 1.4845 with an increased silicon content which enhances the steel's resistance to oxidation/corrosion but has also made it more susceptible to embrittlement.Applications: Heat and creep r..
CTE, linear	20.0 µm/m-°C @Temperature -80.0 - 225 °C	11.1 µin/in-°F @Temperature -112 - 437 °F	(12µm polyimide/9µm copper); ASTM E831-06
NeXolve TR-Clad™ Flexible Polyimide Laminate The lightest weight copper clad laminates available.TR-Clad™ Flexible Laminates are both the lowest weight and lowest dielectric constant of copper/polyimide laminates available. Additionally, TR..
CTE, linear	20.0 µm/m-°C @Temperature <=143 °C	11.1 µin/in-°F @Temperature <=289 °F	ISO 11359
Victrex® PEEK 150GL30 30% Glass Fiber Reinforced Product Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact c..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Alpha 1; TMA
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE3035BL Polyphenylene Sulfide Alloy Xtel® XE3035BL is a high performance, glass fiber reinforced, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information p..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE3035NA Polyphenylene Sulfide Alloy Xtel® XE3035NA is a high performance, glass fiber reinforced, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information p..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100A Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100EN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	ASTM D696-91
DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100VN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300A Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 300HN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300ZT Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500A Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500ZT Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available ..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 941 Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 9461P Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 9461PC Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	20.0 µm/m-°C @Temperature 25.6 - 871 °C	11.1 µin/in-°F @Temperature 78.0 - 1600 °F
Carlson Nitronic® 50® Austenitic Stainless Steel General DescriptionNitronic 50 is a nitrogen-strengthened austenitic stainless steel that possesses corrosion resistance superior to 316, 316L, 317 and 317L plus approximately twice the yield streng..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 965 Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 9462P Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature <=871 °C	11.1 µin/in-°F @Temperature <=1600 °F
AK Steel 316 Austenitic Stainless steel AK Steel 316 contains molybdenum. This addition increases general corrosion resistance, improves resistance to pitting from chloride ion solutions, and provides increased strength at elevated tempe..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4948 High Temperature Austenitic Stainless Steel Creep-resistant variant of 1.4301, with a standardized minimum carbon content for service at temperatures of up to 800°C in dry air.Applications: Heat and creep resistance. For use over 550°C for..