Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Transverse to Flow | 66.3 µm/m-°C @Temperature 20.0 °C |
36.8 µin/in-°F @Temperature 68.0 °F |
|
Cookson Group Plaskon® LS-16S Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf.. |