Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | ASTM D3418 |
CRG Industries Essemplex AF34 Thermoplastic Shape Memory Polymer Resin Essemplex is a melt-processible shape memory polymer (SMP) resin. Its unique properties offer versatile design options for reconfiable and customizable products. Essemplex is compatible with current.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | |
Arkema Group PLATAMID® 8020 Copolyamide Platamid® 8020 is a transparent, thermoplastic copolyamide designed for conversion by standard molding or extrusion techniques.Information provided by Arkema Group |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | 10°C/min |
Arkema Group Rilsan® 8020 Nylon 11, Flexible Tubing Grade (Dry) Designation ISO 1874-PA11/xx,E,16-003Transparent and flexible copolymer for tubes extrusion. Additive free.Good flexibility. Very good transparency. High chemical resistance.USP XXIII class VI appro.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | |
3M Scotch-Weld™ DP-100NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP-100NS is a two-part adhesives offering fast cure and machinability.Information provided by 3M |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | onset |
3M Scotch-Weld™ DP8010 Structural Adhesive 3M™ Scotch-Weld™ Structural Plastic Adhesive DP-8010 is a two-part acrylic-based adhesive (10:1 ratio by volume) that can bond many low surface energy plastics, including many grades of Polypropyl.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | onset |
3M Scotch-Weld™ DP8010NS Structural Adhesive 3M™ Scotch-Weld™ Structural Plastic Adhesive DP-8010NS is a two-part acrylic-based adhesive (10:1 ratio by volume) that can bond many low surface energy plastics, including many grades of Polyprop.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | TM R050-25 |
Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | TM R050-25 |
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | |
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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Glass Transition Temp, Tg | 34.0 °C | 93.2 °F | TM R050-25 |
Resinlab® EP1026 Black Epoxy Adhesive Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |