Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 168 °C | 334 °F | |
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i.. |
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Glass Transition Temp, Tg | 168 °C | 334 °F | ASTM E1356 |
Solvay Specialty Polymers PrimoSpire® PR-250 Polyphenylene, Self-Reinforced (SRP) PrimoSpire® PR-250 resin is an injection molding grade of self-reinforced polyphenylene (SRP). PrimoSpire® SRP is an ultra-high performance amorphous, melt-processable polymer. The unique prop.. |
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Glass Transition Temp, Tg | 168 °C | 334 °F | ISO 11357 |
Arkema Group Rilsan® Clear G170 Polyamide Rilsan® Clear G170 is a high performance transparent polyamide with outstanding thermal resistance. This grade has been designed for extrusion and injection molding applications and for medical use.. |