Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | Ultimate Tg; DSC |
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | ETM 300-90 |
ExxonMobil ESCOREZ™ 5615 Petroleum Hydrocarbon Resin Very light colored aromatic modified, cycloaliphatic hydrocarbon resin. Designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS block copolymers and metallocene polyolefins. A.. |
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Glass Transition Temp, Tg | >= 68.0 °C | >= 154 °F | |
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Epoxyset Epoxibond EB-130M-1 Unfilled Epoxy Adhesive A two-component, non-hazmat, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat.. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and.. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I.. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | |
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | TM R050-25 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Glass Transition Temp, Tg | 68.0 °C | 154 °F | TM R050-25 |
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |