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Polymer Property : Glass Transition Temp, Tg = 50.0 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 50.0 °C
122 °F
ISO 11357-1
Murtfeldt Murlubric® Oil Modified Nylon 6
Murlubric® is a modified cast polyamide that mineral oil is integrated into during polymerization. As a result, the material has self lubricating properties and retains its excellent characteristi..
Glass Transition Temp, Tg 50.0 °C
122 °F
Permabond ET505 Epoxy Resin
PERMABOND ET505 is a two-part, 1:1 mixable epoxy adhesive. ET505 is a semi-flexible toughened epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plas..
Glass Transition Temp, Tg 50.0 °C
122 °F
Lucite International Elvacite ® 2045 Acrylic Resin
Elvacite® 2045 is a high molecular weight iso-butyl methacrylate polymer. Elvacite® 2045 is useful in topcoats for vacuum metallized plastics and in lacquers for other solvent – sensitive..
Glass Transition Temp, Tg 50.0 °C
122 °F
ASTM E1356
SK Chemicals SKYTHANE® US210 Magnetic Binder
Description: SK Chemicals has supplied Thermoplastic Polyurethane Elastomer (TPU) under the name of SKYTHANE. Applications include:Keyboard CoversOutsoles of Soccer ShoesWire and CableAirbagsSheets ..
Glass Transition Temp, Tg 50.0 °C
122 °F
Ultimate Tg; TMA
Tra-Con Tra-Bond 516H02 Fiber Optic Adhesive
TRA-BOND 516H02 is a low viscosity, room temperature or low temperature curing fiber optic adhesive with good stress relief, high adhesion, and low shrinkage upon cure. TRA-BOND 516H02 contains very..
Glass Transition Temp, Tg 50.0 °C
122 °F
Ultimate Tg; TMA
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive
TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub..
Glass Transition Temp, Tg 50.0 °C
122 °F
Ultimate Tg
Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive
TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s..
Glass Transition Temp, Tg 50.0 °C
122 °F
Loctite® 3151 1 component acrylic UV/Heat Cure Acrylic Adhesive
Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Glass Transition Temp, Tg 50.0 °C
122 °F
Loctite® Output™ 315 Acrylic Adhesive
Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Glass Transition Temp, Tg >= 50.0 °C
>= 122 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy
Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Glass Transition Temp, Tg >= 50.0 °C
>= 122 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy
Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Glass Transition Temp, Tg >= 50.0 °C
>= 122 °F
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Glass Transition Temp, Tg 50.0 °C
122 °F
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive
EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Glass Transition Temp, Tg 50.0 °C
122 °F
dry, dynamic; DIN 53 736
Hippe PA 66 Nylon 66
The polyamide with high degree of hardness, stiffness, scuff strength and stability of shape under heat. Preferred polyamide for components subjected to high load and heat stress in electrical, mec..
Glass Transition Temp, Tg 50.0 °C
122 °F
DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® RS 30G30HSL BK038A Nylon 610
30% Glass Reinforced Renewably Sourced Polyamide 610 Developed for Extrusion Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 50.0 °C
122 °F
BCC Products BC 100 Medium Cyanoacrylate Adhesive
BC100 Medium, like its name in the medium viscosity version of cyanoacrylate adhesive that has become most popular in the super bonding applications. A 12 second fixture bond makes the BC100 the fas..
Glass Transition Temp, Tg 50.0 °C
122 °F
3M Scotchkote™ 162PWX Epoxy Coating
3M Scotchkote Epoxy Coating 162PWX is a 100% solid two-part epoxy coating that has been specifically developed for the long term protection of drinking water pipelines, storage and process tanks or ..
Glass Transition Temp, Tg 50.0 °C
122 °F
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Glass Transition Temp, Tg 50.0 °C
122 °F
TM R050-25
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive
Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..
Glass Transition Temp, Tg 50.0 °C
122 °F
TM R050-25
Resinlab® EP1305LV Clear Epoxy Casting Resin
Resinlab™ EP1305LV Clear is a black two-part epoxy casting resin designed to give good adhesion to metals and especially PVC. It has good wetting to most surfaces and is free flowing to penetrate c..
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