Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Permabond ET500 Epoxy Resin PERMABOND ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room tempera.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Permabond ET515 Epoxy Resin PERMABOND® ET515 is a 1:1 mixable epoxy adhesive. ET515 is a semi-flexible toughened adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Humiseal 2A64 Urethane Conformal Coating Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Mallard Creek Polymers ROVENE® 4201 SBR Emulsion ROVENE® 4201 is a carboxylated styrene-butadiene emulsion that has a stiff or "boardy" hand. This binder is recommended for use as a crosslink-able binder for durable nonwovens such as floor main.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Lucite International Elvacite ® 4104 Acrylic Resin Elvacite® 4104 is designed for use in self-levelling flooring formulations, but can be used in a variety of coatings formulations, such as covercoats, heat seal lacquers and plastic coatings. It .. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DIN EN ISO 3146 |
GEHR Plastics PA 6 C Nylon 6 Cast Very stressed-relieved and high-molecular weight PA6.Temperature resistant from -40° to approx. 100°C and high stiffness, hardness and toughness. The good mechanical characteristics will be ac.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Unitika elitel UE3250 Polyester, Pellet High elongation type UE3240, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as a.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Unitika elitel UE3320 Polyester, Flake Low molecular weight type UE3200, High OH type, Resin modifier, Resin raw materialUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their application.. |
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Glass Transition Temp, Tg | 40.0 - 80.0 °C | 104 - 176 °F | |
Zeus ETFE Tubing ETFE (Ethylenetetrafluoroethylene), a copolymer of ethylene and tetrafluoroethylene, is used in applications requiring excellent impact, abrasion and stress cracking resistance. This polymer possess.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
Tra-Con Tra-Bond FS469 Clear High Strength Epoxy TRA-BOND FS469 is a clear low viscosity epoxy formulation designed for bonding and coating micro-electronics, laminations, optical components and laser assemblies. The low cure shrinkage (using a ro.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Unitika elitel UE3216 Polyester, Pellet Low Tg type UE3215UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders, and modi.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | ETM E-90 |
ExxonMobil Escorez™ 5490 Tackifying Resin Product Description: Escorez™ 5400 series resins are very light color cycloaliphatic hydrocarbon resins. They are designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS blo.. |
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Glass Transition Temp, Tg | 40.0 - 48.0 °C | 104 - 118 °F | UV Postcure; ASTM E1545-05A |
DSM Somos® NeXt LV Grey The second member of the Somos® NeXt family, Somos® NeXt LV Grey delivers the durability and functionality, with a finer resolution of details and faster part processing. This third-generation, hi.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | |
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | |
Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy .. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DMA, E" |
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 250 System Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 250 system.Typical ApplicationsMulti-purpose modelsRTV mold patternsForm/Fit/.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DMA, E" |
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 500 System Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 500 system.All information provided by 3D Systems. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used .. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Permabond ET514 Epoxy Resin PERMABOND ET514 is a 1:1 mixable epoxy adhesive. It has excellent resistance to impact and vibration and is ideal for structural bonding of metal, wood, composites and certain plastics. Its rapid cu.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | TM R050-25 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |