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- Polymer Property : Glass Transition Temp, Tg = 100 °C
Polymer Property : Glass Transition Temp, Tg = 100 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Colacryl ® CRG107 Specialty Acrylic Resin Colacryl® CRG107 is a hard, methyl methacrylate based, acrylic resin with exceptional pigment wetting properties. It is soluble in chlorinated hydrocarbons, ketones and lower esters and compatibl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: Stiffness, high mechanical stability, low formaldehyde applicationsApplications: Thermo MoldableEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Wolf Kunststoff ZEDEX® ZX-530CD3 031 Polymer Alloy, Fiber Reinforced and PTFE Modified Main Characteristics: Dimensionally stable and rigid; Stress resistant; Extremely low wear to 100 ° CApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsIn.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | JIS K7121 |
| Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer Zeonor 1020R shall be in the form of pellets. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeus PFA Tubing PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.Inf.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Hexcel® HexPly® M32 Epoxy Matrix HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Eastman Sahara Film Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 168 N Polystyrene (Europe) High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 158 K Polystyrene (Global) Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate
(discontinued **) 12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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