Thermal Properties | Metric | English | Comments |
---|---|---|---|
Melting Point | 48.0 - 112 °C | 118 - 234 °F | Average value: 75.6 °C Grade Count:70 |
Overview of materials for Ethylene Vinyl Acetate Copolymer (EVA), Adhesive/Sealant Grade This property data is a summary of similar materials in the MatWeb database for the category "Ethylene Vinyl Acetate Copolymer (EVA), Adhesive/Sealant Grade". Each property range of values reported .. |
|||
Melting Point | 98.0 - 112 °C | 208 - 234 °F | |
Indium Corp. Indalloy 54 Bismuth Solder Alloy Information Provided by Indium Corporation |
|||
Melting Point | 105 - 112 °C | 221 - 234 °F | DSC Peak |
Arkema Group PLATAMID® H106 PA80 Powder Copolyamide Platamid® H106 PA powder is a special purpose, medium melting point, very low viscosity, thermoplastic copolyamide adhesive suitable for thermal bonding and laminating of textile and foam substrate.. |