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Polymer Property : Minimum Service Temperature, Air = -452 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | <= -269 °C | <= -452 °F | |
| Special Metals INCOLOY® alloy 908 INCOLOY® alloy 908 (UNS N09908) is an age-hardenable nickel-iron alloy which exhibits a low coefficient of thermal expansion, high tensile strength, high fracture and impact toughness, fatigue cr.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100ZT Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200A Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ar.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200FPC Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thickn.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 300A Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 300VN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500VN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50EN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50KN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50VN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200ZT Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available in.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200VN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available in.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Average value: -269 °C Grade Count:31 |
| Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |
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