Mechanical Properties | Metric | English | Comments |
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Shear Strength | 20.0 - 32.0 MPa @Temperature 22.0 °C, Time 86400 sec |
2900 - 4640 psi @Temperature 71.6 °F, Time 24.0 hour |
ISO 10123; Compressive, Steel pins and collars |
Palm Labs Adhesives TURBO-LOCK SERIES 17-OR Anaerobic Thread Locking Compound BEARING AND SHAFT - SERIES 17-OR is a fast curing, GREEN, high strength, oil resistant, close fit, anaerobic retaining compound for bonding, sealing and retaining of cylindrical parts. It is highly .. |
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Shear Strength | 20.0 MPa @Temperature 26.7 °C |
2900 psi @Temperature 80.0 °F |
ASTM D732 |
Greene Tweed Avalon® 16 PTFE, Glass, Molybdenum Filled Products made from Avalon® thermoplastics are constructed from proprietary high-performance reinforced PTFE material. Greene, Tweeds Avalon thermoplastics, available in grades ranging from virgin.. |
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Shear Strength | 20.0 MPa @Temperature 23.9 °C |
2900 psi @Temperature 75.0 °F |
Cure cycle: 7 days @ RT (+7 days gasoline soak) , with Aced Etched 6061-T6 Aluminum |
Zyvex Performance Materials Epovex™ Nano-Engineered Composite Epoxy Adhesive Liquid Epovex® Adhesive is a carbon nanotube enhanced ambient or elevated temperature cure two-part epoxy adhesive. Used for bonding, laminating, filling or potting, Epovex is ideal for many metals, woods.. |
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Shear Strength | 20.0 MPa @Temperature 121 °C |
2900 psi @Temperature 250 °F |
Lap Shear |
Hexcel® Redux® 308 Modified epoxy film adhesive Redux 308 is a high-strength film adhesive curing at 350°F. It is suitable for a wide range of structural bonding applications including metal to metal bonding and sandwich constructions, where ope.. |
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Shear Strength | 20.0 MPa @Temperature 121 °C |
2900 psi @Temperature 250 °F |
Lap Shear |
Hexcel® Redux® 308A-NA Modified epoxy film adhesive Redux 308A-NA is a high-strength, flow-controlled film adhesive with flexible cure schedules at 300°F or 350°F. Redux 308A-NA contains glass beads that give good flow control. It is suitable for m.. |
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Shear Strength | 20.0 MPa @Temperature 177 °C |
2900 psi @Temperature 350 °F |
Lap Shear |
Hexcel® Redux® 322 Modified epoxy film adhesive (0.078 psf) Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up .. |