Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |
|||
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |
|||
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |
|||
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |
|||
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |
|||
Flexural Modulus | 0.109 GPa | 15.8 ksi | Tangent; ISO 178 |
A. Schulman FORMION™ FI 241E Non-Reinforced, Extrusion Grade Ionomer Alloy DescriptionFormion® FI 241E is a patented non-reinforced, extrusion grade Ionomer alloy. It has bee formulated for high durability, low gloss, and low temperature ductility.ApplicationFormion® FI.. |