Polymer Property : Shear Strength = 1700 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	11.7 MPa	1700 psi	ASTM D732
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet)
Shear Strength	11.7 MPa	1700 psi	Cured 1 hour at 125°C, Au/Au
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
Shear Strength	>= 11.7 MPa	>= 1700 psi	Die
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Shear Strength	11.7 MPa	1700 psi	Die
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Shear Strength	11.7 MPa	1700 psi	Overlap, Cold Rolled Steel
3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it comb..
Shear Strength	11.7 MPa	1700 psi	Overlap, Stainless Steel MEK/abrade/MEK
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
Shear Strength	11.7 MPa	1700 psi	Overlap, Aluminum, Adhesive Failure
3M Scotch-Weld™ Thin Instant Wood Adhesives and Surface Activator 3M™ Scotch-Weld™ Instant Wood Adhesives an Surface Activator are single component, room temperature-curing adhesives that provides cure and speed and shear strength for demanding applications in t..
Shear Strength	11.7 MPa	1700 psi	Overlap, CRS/CRS; ASTM D1002
3M Scotch-Weld™ 2216 B/A Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..
Shear Strength	11.7 MPa	1700 psi	ASTM D732
Quadrant EPP Semitron® ESd 500 HR PTFE, static dissipative, compression molded (ASTM Product Data Sheet)