Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ D Semiconductor Dielectric Resin SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 130 Semiconductor Dielectric Resin SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 1500 Semiconductor Dielectric Resin SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 360 Semiconductor Dielectric Resin SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 620 Semiconductor Dielectric Resin SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 820 Semiconductor Dielectric Resin SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I300 280 Semiconductor Dielectric Resin SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I300 380 Semiconductor Dielectric Resin SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | |
Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl.. |
|||
Tensile Strength, Ultimate | 89.0 MPa | 12900 psi | ASTM D638 |
A. Schulman ComAlloy Hiloy® 616 Nylon 6, Mineral Reinforced Data provided by the manufacturer, ComAlloy International Company.40% Mineral Reinforced.The ComAlloy product line has been integrated into the A Schulman product line. |
|||
Tensile Strength, Ultimate | 89.0 MPa @Temperature 1093 °C |
12900 psi @Temperature 1999 °F |
|
Haynes 230® alloy, as cast vacuum investment casting Excellent high-temperature strength, outstanding resistance to oxidizing environments up to 1149°C, premier resistance to nitriding environments, and excellent long-term thermal stability. Applicat.. |