Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 0.138 GPa | 20.0 ksi | |
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | TM R050-36 |
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives .. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | Mixed 1:2; TM R050-36 |
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | TM R050-36 |
Resinlab® EP1225 Black Unfilled Epoxy Adhesive Resinlab™ EP1225 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. It has slightly thixotropic viscosity to give gap filling ability bust stil.. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | ASTM D1709 |
Westlake EC474AA Low Density Polyethylene WESTLAKE low-density polyethylene EC474 is a general-purpose formulation used for extrusion coating and laminating. It can be drawn down to low coating weights, is processable at high speeds, has go.. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | ASTM D1709 |
Westlake EC479AA Low Density Polyethylene WESTLAKE low-density polyethylene EC479 is recommended for use in the boardstock coating industry. This resin has low neck-in, good heat sealing properties, and good drawdown characteristics.Applica.. |
|||
Tensile Modulus | 0.138 GPa | 20.0 ksi | |
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |