Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 0.00689 GPa | 1.00 ksi | Storage |
Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and .. |