Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength, Yield | 8.00 MPa @Temperature 21.1 °C |
1160 psi @Temperature 70.0 °F |
Flatwise Tension |
Hexcel® Redux® 322 Modified epoxy film adhesive (0.078 psf) Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up .. |
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Tensile Strength, Yield | 8.00 MPa @Temperature 177 °C |
1160 psi @Temperature 350 °F |
Flatwise Tensile |
Hexcel® Redux® 641K Modified epoxy film adhesive for bonding metallic and composite components Redux 641 is a high temperature modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures where operating temperatures are experienced up t.. |