Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 2.36 GPa | 342 ksi | ASTM D695 |
Quadrant EPP Techtron® HPV PPS (ASTM Product Data Sheet) |
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Compressive Modulus | 2.36 GPa @Temperature 23.0 °C |
342 ksi @Temperature 73.4 °F |
EN ISO 604 |
Ensinger TECASINT 4011 Polyimide, Yellow (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Compressive Modulus | 2.36 GPa @Temperature 23.0 °C |
342 ksi @Temperature 73.4 °F |
EN ISO 604 |
Ensinger TECASINT 4201 SD Polyimide, Black, Carbon Fiber (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Compressive Modulus | 2.36 GPa | 342 ksi | ASTM D695 |
Arlon CuClad 250 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 250 uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directi.. |
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Compressive Modulus | 2.36 GPa | 342 ksi | ASTM-D-695 |
BCC Products EB 6200 Epoxy Tooling Board EB6200 is a “grain-free” elevated temperature epoxy modeling material known for its superior surface finish, dimensional stability and the ability to maintain tolerances even after being subjected.. |