Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Compressive Modulus | 2.07 GPa | 300 ksi | ASTM D695 |
Quadrant EPP Quadrant 1000 LSP PC Extruded Unfilled Polycarbonate |
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Compressive Modulus | 2.07 GPa | 300 ksi | ASTM D695 |
Quadrant EPP Quadrant PC 1000 Extruded, Unfilled, Polycarbonate (ASTM Product Data Sheet) |
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Compressive Modulus | 2.07 GPa | 300 ksi | Average value: 2.07 GPa Grade Count:3 |
Overview of materials for Polycarbonate, Extruded This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Extruded". Each property range of values reported is minimum and maximum values of approp.. |
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Compressive Modulus | 2.07 GPa | 300 ksi | ASTM D695 |
Saint-Gobain Meldin® 7021 Direct Formed Graphite Filled Polyimide Finished parts and basic shapes made from 15% by weight graphite filled polyimide material for applications high wear resistance, good thermal oxidative stability, and high temperature resistance. .. |
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Compressive Modulus | 2.07 GPa | 300 ksi | ASTM D695 |
Quadrant EPP Quadrant LSG PC (ASTM Product Data Sheet) Data provided by Quadrant Engineering Plastic Products. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1.. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula.. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro.. |
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Compressive Modulus | 2.07 GPa | 300 ksi | TM R050-38 |
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |