Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 2.76 GPa | 400 ksi | |
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Acetron® POM-C Copolymer Acetal, Porosity-Free, Unfilled, Extruded |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Ertalyte® TX Internally Lubricated Semi-Crystalline Polyester (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Nylatron® GSM Nylon, Cast MoS2 Filled Type 6 (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Nylatron® MC® 901 Blue, Heat Stabilized, Type 6 (ASTM Product Data Sheet) Data provided by Quadrant Engineering Plastic ProductsBroadest size range availabilityGood mechanical and electrical propertiesIdeal balance of strength and toughnessCast as finished parts and near .. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Nylatron® NSM Nylon, Cast Solid Lubricant Filled, Type 6 (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Nylatron® WP PA (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Semitron® CMP LL5 Polyester (ASTM Product Data Sheet) Enhanced semi-crystalline polyester product for extended service in CMP retaining rings. Superior performance, especially in oxide processes, and cost effective relative to standard ring materials. .. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Semitron® CMP XL20 (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quantum Acetal-Copolymer Information provided by Quantum Advanced Engineering Plastics |
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Compressive Modulus | 2.76 - 5.58 GPa | 400 - 809 ksi | Average value: 4.34 GPa Grade Count:4 |
Overview of materials for Polyetherimide (PEI), 20% Glass Fiber This property data is a summary of similar materials in the MatWeb database for the category "Polyetherimide, 20% Glass Fiber". Specific grades with glass content between 15% and 24% are included. E.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Spartech Polycast MP 1.25 (UL 752 Level 1) Cell Cast Acrylic Description: Cell Cast AcrylicInformation provided by Spartech. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Spartech Polycast SAR HP 1.25 (UL 752 Level 3) Cell Cast Acrylic Description: Cell Cast AcrylicInformation provided by Spartech. |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Spartech Polycast SP 1.25 Cell Cast Acrylic Description: Cell Cast AcrylicInformation provided by Spartech. |
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Compressive Modulus | 2.76 GPa | 400 ksi | |
Engineered Syntactic Systems AZ-40 Deep Water Syntactic Foam Syntactic foams are a combination of hollow spheres, a resin matrix, and other additives. When combined and processed properly, the constituents form a lightweight homogeneous material having high c.. |
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Compressive Modulus | 2.76 GPa @Temperature 22.8 °C |
400 ksi @Temperature 73.0 °F |
ASTM D695 |
Quadrant EPP Duratron® U2100 OEI Extruded 10% Glass Reinforced Polyetherimide |
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Compressive Modulus | 2.76 GPa | 400 ksi | ASTM D695 |
Quadrant EPP Nylatron® MC® 907 Natural Nylon, Monocast® FDA Compliant, Unfilled Type 6 (ASTM Product Data Sheet) |
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Compressive Modulus | 2.76 GPa | 400 ksi | |
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP1199 Black Unfilled Epoxy Adhesive Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP11HT Gray Filled Epoxy Adhesive Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa.. |
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Compressive Modulus | 2.76 GPa | 400 ksi | TM R050-38 |
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |