Polymer Property : Adhesive Bond Strength = 1000 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Adhesive Bond Strength	6.90 MPa	1000 psi	Aluminum, Shear; ASTM D1002
Permabond 930 Cyanoacrylate PERMABOND 930 is a low odor, nonfogging, nonfrosting cyanoacrylate. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The ..
Adhesive Bond Strength	6.90 MPa	1000 psi	Aluminum, Shear; ASTM D1002
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Adhesive Bond Strength	6.90 MPa	1000 psi	Aluminum, Shear; ASTM D1002
Permabond 932 Cyanoacrylate PERMABOND 932 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Adhesive Bond Strength	6.90 MPa	1000 psi	Aluminum, Shear; ASTM D1002
Permabond 935 Cyanoacrylate The PERMABOND 930 series is a family of low odor, non-fogging, non-frosting cyanoacrylates. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyano..
Adhesive Bond Strength	6.90 MPa @Temperature 25.0 Â°C	1000 psi @Temperature 77.0 Â°F	Lap Shear
Henkel Hysol EA 9203 Primer Primer enhances adhesion on poorly prepared surfaces. Requires only room temperature drying prior to bond. Use with room-temperature-curing paste adhesives.Applications: Sprayable Metal and Honeyco..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, adhesion to glass
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 1 hr @ 70°C
Tra-Con Tra-Duct 2705 Room Temperature Conductive Nickel Epoxy Adhesive TRA-DUCT 2705 is an electrically conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI-RFI shielding applications. This two-part smooth paste formulation is fr..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 5 min @ 125°C
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Shear Al/Al
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 2 min @ 150°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear, alum to alum, 72 hrs @ 25°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® U-05FL Urethane Adhesive Urethane AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 ap..
Adhesive Bond Strength	6.89 MPa @Temperature 82.2 °C	1000 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Adhesive Bond Strength	6.89 MPa @Temperature -54.4 °C	1000 psi @Temperature -66.0 °F	Aluminum-Aluminum tensile shear
Armstrong A-702 Epoxy Adhesive Information provided by Ellsworth Adhesives.
Adhesive Bond Strength	6.89 MPa	1000 psi	Al-to-Al Lap Shear; Cured 30 min. at 125ºC, 3-5 mil bond line, Al to Al; ASTM D1002
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT..
Adhesive Bond Strength	6.89 MPa	1000 psi	Al-to-Al Lap Shear; Cured 1 hr at 65ºC; ASTM D1002
Aptek 6516-A/B Electrically conductive epoxy adhesive General purpose, electrically conductive epoxy adhesiveAPTEK 6516-A/B is a two component, 100% solid, silver filled electrically conductive epoxy adhesive specifically designed for the attachment of..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Aluminum to Aluminum
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Aluminum to Aluminum
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® E-90FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Adhesive Bond Strength	6.89 - 42.1 MPa	1000 - 6100 psi	Average value: 19.1 MPa Grade Count:7
Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a..
Adhesive Bond Strength	6.89 MPa	1000 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Adhesive Bond Strength	>= 6.89 MPa	>= 1000 psi	Aluminum to Aluminum
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Adhesive Bond Strength	6.89 - 20.7 MPa	1000 - 3000 psi	Varies with substrates
Loctite® Durabond® E-60NC Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..