Polymer Property : Adhesive Bond Strength = 8.27 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	8.27 MPa	1200 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
Adhesive Bond Strength	8.27 MPa	1200 psi	lap shear (on grit blasted steel, bond line thickness of 0.010"); ASTM D1002
ITW Devcon Safety Clear Coatâ„¢ Epoxy, Water Clear Information provided by ITW Devcon
Adhesive Bond Strength	8.27 MPa	1200 psi	ABS-ABS; Substrate Failure; Tensile Lap Shear
Master Bond MB306 Low Viscosity Methyl Cyanoacrylate Features superior bonding properties. Master Bond MB306 is a single component, low viscosity, rapid setting, methyl cyanoacrylate adhesive. Similar to other types of “super glue”, MB306 cures ver..
Adhesive Bond Strength	8.27 MPa	1200 psi	Lap shear, alum to alum, 24 hrs @ 25°C
Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an..
Adhesive Bond Strength	>= 8.27 MPa	>= 1200 psi	shear, Al/Al
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Adhesive Bond Strength	8.27 MPa	1200 psi
Trelleborg Emerson & Cuming Eccobond® 930-09 Low Temperature Performance Lighting Epoxy Adhesive Emerson & Cuming 930-09 Eccobond® Low Temperature Performance Lighting Epoxy AdhesiveFlexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low ..
Adhesive Bond Strength	>= 8.27 MPa	>= 1200 psi	Lap Shear Strength
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev..
Adhesive Bond Strength	8.27 MPa @Temperature 82.2 °C	1200 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
Armstrong A-2/W Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Adhesive Bond Strength	8.27 MPa	1200 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002
Aptek 2209-A/B Clear, non-yellowing urethane adhesive APTEK 2209-A/B is a water clear, thixotropic, two component, electrically insulating, urethane adhesive designed for bonding various substrates. APTEK 2209-A/B is effective for bonding plastics and..
Adhesive Bond Strength	8.27 MPa	1200 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..