Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 4.14 - 4.83 MPa | 600 - 700 psi | |
Sika Industry SikaTack UltraFast Fast Cure One Part Polyurethane Adhesive Sika UltraFast SikaTack Fast Cure One Part Polyurethane AdhesiveThis revolutionary product uses heat instead of moisture to "pre-cure" the adhesive. The product is heated before applications using a.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Polystyrene-Polystyrene; Substrate Failure; Tensile Lap Shear |
Master Bond MB306 Low Viscosity Methyl Cyanoacrylate Features superior bonding properties. Master Bond MB306 is a single component, low viscosity, rapid setting, methyl cyanoacrylate adhesive. Similar to other types of “super glue”, MB306 cures ver.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 240-2 Polyurethane Adhesive TRA-BOND 240-2 polyurethane adhesive is a low outgassing polyurethane adhesive which meets the requirements of NASA specification SP-R-0022. Information provided by Tra-Con Inc. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear, adhesion to glass |
Tra-Con Tra-Bond 9392 Flexible Potting Epoxy Adhesive TRA-BOND 9392 is a low viscosity, two-part polyurethane formulation recommended for potting and molding where flexibility and temperature resistance are required. TRA-BOND 9349 is a room temperature.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear, alum to alum, 24 hrs @ 25°C |
Tra-Con Tra-Cast 3110 Low Density Epoxy Casting System TRA-CAST 3110 is a unicellular, low density, syntactic-foam epoxy resin casting system of medium viscosity that easily handles, mixes and cures at room temperature. Developed for industrial encapsul.. |
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Adhesive Bond Strength | >= 4.14 MPa | >= 600 psi | Aluminum to Aluminum |
Loctite® 3882 Flexible Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1046FG Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Black is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to.. |
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Adhesive Bond Strength | 4.14 MPa | 600 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1046FG Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Clear is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to.. |