Mechanical Properties | Metric | English | Comments |
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Compressive Strength | 203 MPa @Temperature 25.0 °C |
29400 psi @Temperature 77.0 °F |
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Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther.. |
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Compressive Strength | 203 MPa @Thickness 12.7 mm |
29500 psi @Thickness 0.500 in |
ASTM D695 |
Industrial Laminates/Norplex NP625 Paper Base Laminate Description: Paper phenolic grade with better moisture resistance than NP612. Requires less heat to punch and shear than NP611. |
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Compressive Strength | 203 MPa | 29500 psi | |
SGL Carbon Group Ridurid® V 1352 High Performance Graphite Filled Plastic Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and.. |
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Compressive Strength | 203 MPa | 29400 psi | ASTM D695 |
Sumitomo Bakelite North America E 264H Long Glass Fiber Reinforced Epoxy E 264H is a high strength, long fiberglass reinforced epoxy molding compound, which features improved flow in transfer molding.Information provided by Sumitomo Bak North America, Inc. |
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Compressive Strength | 203 MPa | 29400 psi | ASTM D695 |
Plenco 4301 Phenolic, Granular, Compression Molded PLENCO 04301 is a heat resistant, mineral filled phenolic molding compound offering excellent dimensional stability and electrical properties. UL recognized under component file E40654. 04301 is ava.. |
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Compressive Strength | 203 MPa | 29400 psi | ASTM D695 |
Plenco 2311 Phenolic, Granular, Transfer Molded PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr.. |