Physical Properties | Metric | English | Comments |
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Thickness | 178 microns | 7.01 mil | |
Parker Chomerics CHO-BOND® 1121 General Purpose Adhesive-Sealant Silver Silicone Description: Xylene-free version of CHO-BOND 1038; rec. bond line thickness: > 0.18 mm; primer promotes adhesion CHO-BOND® 1121 is an electrically conductive, one-component silicone adhesive-sealan.. |
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Thickness | 178 microns | 7.01 mil | |
Parker Chomerics Tecknit® 0002 Highly Conductive Adhesive-Sealant Silver Silicone Description: TECKNIT® 0002 is a pure silver filled, one component RTV silicone adhesive-sealant. It is ready to use without mixing and cures quickly at room temperature on exposure to moisture in .. |
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Thickness | 178 microns | 7.01 mil | Thermal Conductor |
Parker Chomerics T-Wings Heat Spreaders Description: Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate. T-Wing spreade.. |