Physical Properties | Metric | English | Comments |
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Viscosity | 50.0 - 3200 cP | 50.0 - 3200 cP | Average value: 1170 cP Grade Count:5 |
Overview of materials for Solventless Epoxy Varnish, Electrical Insulation This property data is a summary of similar materials in the MatWeb database for the category "Solventless Epoxy Varnish, Electrical Insulation". Each property range of values reported is minimum and.. |
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Viscosity | 2600 - 3200 cP | 2600 - 3200 cP | 15% solids in MEK |
Taiwan Sheen Soon Sheenthane® AS-626H TPU for PU Adhesive Thermoplastic polyurethane elastomer for solvent-based polyurethane adhesive.Excellent bonding strength for polyester, TPU, nylon, PVC, leather, fabrics, etc. Used for footwear, textile laminations.. |
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Viscosity | 2600 - 3200 cP | 2600 - 3200 cP | 15% solids in MEK |
Taiwan Sheen Soon Sheenthane® AS-632H TPU for PU Adhesive Thermoplastic polyurethane elastomer for solvent-based polyurethane adhesive.Hydrolysis resistance gradeExcellent bonding strength for polyester, TPU, nylon, PVC, leather, fabrics, etc. Used for fo.. |
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Viscosity | 2600 - 3200 cP | 2600 - 3200 cP | 15% solids in MEK |
Taiwan Sheen Soon Sheenthane® AS-690H TPU for PU Adhesive Thermoplastic polyurethane elastomer for solvent-based polyurethane adhesive.Excellent bonding strength for polyester, TPU, nylon, PVC, leather, fabrics, etc. Used for footwear, textile laminations.. |
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Viscosity | 2200 - 3200 cP @Temperature 23.0 °C |
2200 - 3200 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Viscosity | 2200 - 3200 cP @Temperature 23.0 °C |
2200 - 3200 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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Viscosity | 220 - 3200 cP @Temperature 23.0 °C |
220 - 3200 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |