Physical Properties | Metric | English | Comments |
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Viscosity | 2200 cP | 2200 cP | Mixed; TM R050-12 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Viscosity | 2200 cP @Shear Rate 11200 1/s, Temperature 200 °C |
2200 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
PolyOne Versaflex™ CL2000X Thermoplastic Elastomer (TPE) Versaflex™ CL2000X is an ultra-soft TPE designed for use in injection molding applications where exceptional clarity and an extremely soft feel are desired. - Tactile Feel - Ultra-Soft - Water Clar.. |
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Viscosity | 2200 - 4300 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
2200 - 4300 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2030408P3 Carbon Graphite Ink This product is designed to be used for screen printing working electrodes. This is a carbon/graphite ink which has been optimized to give superior electrochemical performance and contains Cobalt Ph.. |
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Viscosity | 2200 cP @Shear Rate 50.0 1/s, Temperature 240 °C |
2200 cP @Shear Rate 50.0 1/s, Temperature 464 °F |
Melt; ASTM D3835 |
Kureha KF Polymer 1000 PVDF Homopolymer KF Polymer is a fire-resistant engineering plastic which maintains the excellent performance of a fluoropolymer. It shows well-balanced molding processability similar to general-purpose resins. KF p.. |
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Viscosity | 2200 - 2400 cP @Temperature 23.0 °C |
2200 - 2400 cP @Temperature 73.4 °F |
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Master Bond MB297 Cyanoacrylate Adhesive System General purpose, fills gap to 0.008Information provided by Master Bond Inc. |
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Viscosity | 2200 cP | 2200 cP | Mixed (cp #40, 2.5 rpm) |
Tra-Con Tra-Bond 516E01 Information provided by Tra-Con Inc. |
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Viscosity | 2200 cP @Temperature 25.0 °C |
2200 cP @Temperature 77.0 °F |
Mixed (rv #4, 20 rpm) |
Tra-Con Tra-Bond F113SC BLK High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC BLK is a fiber optic adhesive used for terminating ALL types of fiber optic connectors as well as LED displays, lenses and other optical components. It produces a typical Tg of 95°C.. |
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Viscosity | 2200 cP @Temperature 25.0 °C |
2200 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 2651-40/23LV Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as .. |
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Viscosity | 2200 cP @Temperature 25.0 °C |
2200 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond 2202 Low Viscosity/High Temperature Epoxy Adhesive TRA-BOND 2202 is a low viscosity, high temperature cure epoxy resin system developed for rigid laminating, filament winding, potting and bonding applications where a clear, almost transparent adhesi.. |
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Viscosity | 2200 cP @Temperature 25.0 °C |
2200 cP @Temperature 77.0 °F |
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Cytec EN-2534 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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Viscosity | 2200 - 3200 cP @Temperature 23.0 °C |
2200 - 3200 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Viscosity | 2200 - 3200 cP @Temperature 23.0 °C |
2200 - 3200 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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Viscosity | 2200 cP | 2200 cP | dynamic |
Dow Corning EG-3000 THIXOTROPIC GEL PARTS A&B Two-part, heat cure, thixotropic gel.Information provided by Dow Corning |
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Viscosity | 2200 cP @Temperature 180 °C |
2200 cP @Temperature 356 °F |
Modified Bitumen Property in waterproof membranes (150/200 bitumen + 12% polymer) |
Dynasol Solprene® 411 Thermoplastic Rubber SBS Dry Solprene 411 is a 70/30 butadiene/styrene thermoplastic copolymer, polymerized in solution and has a radial structure.This product is available in:S 411 porous crumbS 411M powder form dusted with am.. |
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Viscosity | 2200 cP | 2200 cP | Mixed |
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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Viscosity | 2200 cP | 2200 cP | Mixed |
Armstrong C-1/H20 Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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Viscosity | 2200 cP | 2200 cP | |
ACC EP MAP-7.5 EPI Engineered Polymers Aliphatic Polymer EP MAP, “Powered by Reactamine® Technology”, are modified aliphatic prepolymers with monomer-extracted levels of a maximum of 0.2%. The polymers are made from HDI. EP MAP-7.5 contains 7.5% NCO. .. |
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Viscosity | 2200 cP @Temperature 180 °C |
2200 cP @Temperature 356 °F |
Modified Bitumen Property in waterproof membranes (150/200 bitumen + 12% polymer) |
Dynasol Calprene® 411 Thermoplastic Rubber SBS Dry Calprene 411 is a 70/30 Butadiene/Styrene thermoplastic copolymer, polymerized in solution and has a radial structure.This product is available in:C 411 porous crumbC 411C porous pelletC 411M powder.. |
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Viscosity | 2200 cP | 2200 cP | Mixed; TM R050-12 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |