Polymer Property : Viscosity = 2000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	2000 cP	2000 cP
Resinlab® CYNERGY CA6105 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Viscosity	2000 - 3000 cP @Temperature 25.0 °C	2000 - 3000 cP @Temperature 77.0 °F	Uncured
Permabond UV620 UV-curable Adhesive PERMABOND UV620 is a single part, fast curing, UV curable adhesive. Its excellent optical clarity and resistance to yellowing make it ideal for bonding glass and crystal for a high quality finish. I..
Viscosity	2000 - 3000 cP @Temperature 25.0 °C	2000 - 3000 cP @Temperature 77.0 °F	Uncured
Permabond UV670 UV-curable Adhesive PERMABOND UV670 is a single part, fast curing, UV curable adhesive. The cured adhesive is tough, flexible and has excellent impact resistance. Permabond UV670 is well suited for bonding glass to met..
Viscosity	2000 cP	2000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Viscosity	2000 cP	2000 cP	Mixed; TM R050-12
Resinlab® UR3001HP Black Urethane Encapsulant Resinlab™ UR3001HP Black is a black, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Black provides excellent e..
Viscosity	2000 cP	2000 cP
NextGen Adhesives G907-08 Epoxy Adhesive Description: NGAC G907-08 is a low viscosity, electrically insulating, heat cured and 2-part adhesive systems designed for applications where temperature and chemical resistance is critical. The NGA..
Viscosity	2000 - 5000 cP	2000 - 5000 cP
Huntsman Araldite GY 508 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 390 to 425. Max color is 5.Comments/Applications: BPA epoxy blended with a polyglycol di-epoxide. The higher EEW allows much lower hardener levels. Flexible resin f..
Viscosity	2000 - 3000 cP	2000 - 3000 cP	20% Toluene Solution at 25Â°C; BAM 922
KratonÂ® D1116 K (SBS) Radial Triblock Copolymer Description: Kraton D1116 K is a clear, radial triblock copolymer based on styrene and butadiene, with a polystyrene content of 23%. It is supplied from North America in the physical form identified..
Viscosity	2000 cP	2000 cP	8% Solid, 1.5% NaCl
Solvay MACKADETÂ® EQ-178 Surfactant Product Description: Mackadet EQ-178 is a mild, concentrated blend of surfactants for use as a base for high foam personal care products. This blend is free of alcohol, diethanolamides, lauryl sulfa..
Viscosity	<= 2000 cP	<= 2000 cP	#3 SP @ 12 rpm
Solvay MACKANATEÂ® OPSV Surfactant Product Description: Mackanate OPSV is a sulfosuccinate half ester of Oleamide MIPA made from vegetable feedstock. As such, it is a very mild surfactant to both eyes and skin. When blended with high..
Viscosity	2000 cP @Temperature 25.0 °C	2000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond F123NC High Temperature Fiber Optic Epoxy Adhesive TRA-BOND F123 NC is a fast cure, low viscosity, two-component epoxy formulation for bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connecto..
Viscosity	2000 cP @Temperature 23.0 °C	2000 cP @Temperature 73.4 °F
Master Bond EP30-4 Fast Curing Non-Yellowing Two Component Epoxy System Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated tempe..
Viscosity	2000 - 3000 cP @Temperature 23.0 °C	2000 - 3000 cP @Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Viscosity	2000 - 10000 cP	2000 - 10000 cP	Dynamic
Dow Corning XIAMETER® PMCPOFX-8803 Fluid Is chemically equivalent to DOW CORNING® 8803 POLYMER. An organofunctional silicone softener that imparts softness to a variety of textile substrates. Can be easily formulated into a microemulsion ..
Viscosity	2000 - 4100 cP @Temperature 23.0 °C	2000 - 4100 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Viscosity	2000 - 6000 cP	2000 - 6000 cP
3M Novec™ FC-4430 Fluorosurfactant 3M™ Novec™ Fluorosurfactant FC-4430 is a non-ionic polymeric fluorochemical surfactant belonging to a class of coating additives which provide low surface tensions in coating systems best served b..
Viscosity	2000 cP	2000 cP
ACC EP MAP-8.5 EPI Engineered Polymers Aliphatic Polymer EP MAP, “Powered by Reactamine® Technology”, are modified aliphatic prepolymers with monomer-extracted levels of a maximum of 0.2%. The polymers are made from HDI. EP MAP-8.5 contains 8.5% NCO. ..
Viscosity	2000 cP	2000 cP	"B" component
ACC QGel 300 QSI Quantum Silicones High Strength Gel QGel 300 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
Viscosity	2000 cP	2000 cP	"B" component
ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par..
Viscosity	2000 cP	2000 cP	"A" component
ACC QLE 1101 QSI Quantum Silicones Specialty Silicone Coating QLE 1101 is a low viscosity, two-component, addition cure, silicone elastomer.Key Features: Fast cure at elevated temperaturesLow linear shrinkageTransparent, ideal for pigmentationLow viscosity Par..
Viscosity	2000 cP	2000 cP	Uncatalyzed, QM 262B
ACC QM 262 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM262 is a two component, room temperature, addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin ..
Viscosity	2000 - 2500 cP	2000 - 2500 cP	Brooksfield LV Viscometer
Aremco Cerama-Dip™ 538-N High Temperature Specialty Ceramic-Inorganic Coating Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available.
Viscosity	2000 cP	2000 cP	Part B, RVT, #3, 20 rpm; TM R050-12
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Viscosity	2000 - 5500 cP @Shear Rate 230 1/s, Temperature 25.0 °C	2000 - 5500 cP @Shear Rate 230 1/s, Temperature 77.0 °F	Haake VT 550 PK1.1°
Gwent Electronic Materials C2030519P5 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes when used in conjunction with NAD+/NADH dependent dehydrogenase enzymes, enable the detection..
Viscosity	2000 - 3000 cP	2000 - 3000 cP	mixed
Master Bond EP39MHT Two Component, Room Temperature Curing Epoxy Resin System Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to..
Viscosity	2000 cP	2000 cP	Part B, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..