Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 1.60 - 400000 cP | 1.60 - 400000 cP | Average value: 80000 cP Grade Count:5 |
Overview of materials for Polybutylene Terephthalate (PBT), Unreinforced, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polybutylene Terephthalate (PBT), Unreinforced, Molded". Each property range of values reported is minim.. |
|||
Viscosity | 300000 - 400000 cP | 300000 - 400000 cP | Paste |
Lucas-Milhaupt Lucanex 616 Active Metal Brazing Brazing Paste Blended with Ti for active metal brazing of ceramics.Information provided by Lucas-Milhaupt, Inc.Alloy compositions are for filler metal powder in Lucanex paste |
|||
Viscosity | 300000 - 400000 cP | 300000 - 400000 cP | Paste |
Lucas-Milhaupt Lucanex 716 Active Metal Brazing Brazing Paste Blended with Ti for active metal brazing of ceramics.Information provided by Lucas-Milhaupt, Inc.Alloy compositions are for filler metal powder in Lucanex paste |
|||
Viscosity | 300000 - 400000 cP | 300000 - 400000 cP | Paste |
Lucas-Milhaupt Lucanex 721 Active Metal Brazing Brazing Paste Blended with Ti for active metal brazing of ceramics.Information provided by Lucas-Milhaupt, Inc.Alloy compositions are for filler metal powder in Lucanex paste |
|||
Viscosity | 300000 - 400000 cP | 300000 - 400000 cP | 1 rpm |
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
|||
Viscosity | 250000 - 400000 cP @Temperature 23.0 °C |
250000 - 400000 cP @Temperature 73.4 °F |
1 rpm |
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |