Physical Properties | Metric | English | Comments |
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Viscosity | 3000 cP @Temperature 190 °C |
3000 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 1330 Amorphous Polyalphaolefin (APAO) Laminate Grade.Description: Ethylene copolymer and FDA compliantFeatures: Medium open timeApplications: Lamination of reinforced tapes and protective overwrapsOther Properties: Ring and Ball Softeni.. |
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Viscosity | 3000 - 5000 cP | 3000 - 5000 cP | 25% Toluene Solution at 25°C; KM 06 |
Kraton® D1101 A (SBS) Liner Block Copolymer Description: Kraton D1101 A polymer is a clear, linear block copolymer based on styrene and butadiene with bound styrene of 31% mass. It is supplied from Europe in the physical forms identified as f.. |
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Viscosity | 3000 - 5000 cP | 3000 - 5000 cP | 25% Toluene Solution at 25°C; KM 06 |
Kraton® D1101 J (SBS) Liner Block Copolymer Description: Kraton D1101 J is a clear, linear block copolymer based on styrene and butadiene with bound styrene of 31% mass. It is supplied from Japan in the physical form(s) outlined in the follow.. |
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Viscosity | 3000 - 5500 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
3000 - 5500 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2030922D1 Silver Ink Silver Ink C2030922D1 is a grey ink with a pine smell at a ready to use viscosity suitable for firing on glass and ceramic to form conductive tracks. The ink should be gently stirred before use avo.. |
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Viscosity | 3000 - 5000 cP | 3000 - 5000 cP | 30% solid in Anone |
Taiwan Sheen Soon Sheenthane® A7810L TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati.. |
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Viscosity | 3000 - 7000 cP | 3000 - 7000 cP | RP-17619 |
Solvay MIRACARE® MP-24 Surfactant Description: MIRACARE MP-24 is a universal Performance Concentrate formulated to produce shampoo, skin cleansing, and related bath and toiletry products. With simple water dilution MIRACARE MP-24 yi.. |
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Viscosity | <= 3000 cP | <= 3000 cP | |
Solvay MIRAPOL® WT Surfactant Description: Polymeric quaternary ammonium saltIdentification: CATIONIC POLYMERCAS: 68555 – 36 – 2Solublility: Readily soluble in water can be diluted in amphoteric compounds.Available in:.. |
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Viscosity | 3000 - 15000 cP | 3000 - 15000 cP | |
Solvay POLYCARE® BOOST Surfactant Description: Water based emulsion of a high molecular weight linear polydimethylsiloxane containing a high delivery conditioning polymerC.T.F.A. /I.N.C.I. Name: WATER (AND) DIMETHICONE (AND) POLYQUA.. |
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Viscosity | 3000 - 4800 cP @Temperature 150 °C |
3000 - 4800 cP @Temperature 302 °F |
542-111 |
Westlake Epolene® C-15 Coating Grade - Highly Branched Medium Molecular Weight Polyethylene Polymer Product Description: Epolene C-15 is a branched low density polyethylene homopolymer with low color and medium molecular weight. It is useful as a base polymer for adhesives and coatings, color conc.. |
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Viscosity | 3000 - 4800 cP @Temperature 150 °C |
3000 - 4800 cP @Temperature 302 °F |
542-111 |
Westlake Epolene® C-15P Coating Grade - Branched Medium Molecular Weight Polyethylene Polymer Description: Epolene C-15P is a branched low density polyethylene homopolymer powder with low color and medium molecular weight. It is useful as a base polymer for adhesives and coatings, color conc.. |
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Viscosity | 3000 cP @Temperature 25.0 °C |
3000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Cast 3101 Encapsulating Adhesive System TRA-CAST 3101 is an easy-to-use, room temperature cure, rigid, low viscosity, 100% solids (no solvents) epoxy resin and hardener system with excellent mechanical and electrical properties. It is rec.. |
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Viscosity | 3000 - 4000 cP @Temperature 23.0 °C |
3000 - 4000 cP @Temperature 73.4 °F |
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Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r.. |
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Viscosity | 3000 - 4000 cP @Temperature 23.0 °C |
3000 - 4000 cP @Temperature 73.4 °F |
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Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se.. |
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Viscosity | 3000 cP | 3000 cP | Dynamic |
Dow Corning SYL-OFF® PMCP7012 Release Modifier Syl-off® 7012 Release Modifier is a 100% active solids, pre-catalysed, release modifier. Offers particularly smooth release modification.Information provided by Dow Corning |
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Viscosity | 3000 cP @Temperature 25.0 °C |
3000 cP @Temperature 77.0 °F |
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Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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Viscosity | 3000 - 4000 cP @Temperature 23.0 °C |
3000 - 4000 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil.. |
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Viscosity | 3000 cP | 3000 cP | |
Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica.. |
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Viscosity | 3000 cP | 3000 cP | |
Abatron ClearStrip™ Stripper for Paint, Varnish, Coatings; Gel ClearStrip™ is a high-performance gel designed to remove multiple coats of paint safely. It wets the paint surface for a long time, which allows the paint loosening process to continue for longer t.. |
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Viscosity | <= 3000 cP @Temperature 75.0 °C |
<= 3000 cP @Temperature 167 °F |
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Aquabond Technologies Aquabond™ ABS-85 Water Soluble Adhesive and Bonding Thermoplastic Description: Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing and comes in 3 different bonding tem.. |
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Viscosity | <= 3000 cP @Temperature 75.0 °C |
<= 3000 cP @Temperature 167 °F |
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Aquabond Technologies Aquabond™ ABS-65 Water Soluble Adhesive and Bonding Thermoplastic Description: Aquabond's water soluble thermoplastic is designed for temporary mounting of hard materials for slicing, dicing, grinding, lapping and polishing and comes in 3 different bonding tem.. |
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Viscosity | 3000 cP | 3000 cP | Mixed; TM R050-12 |
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |
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Viscosity | 3000 cP | 3000 cP | Part B, RVT, #5, 20 rpm; TM R050-12 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Viscosity | 3000 cP @Temperature 190 °C |
3000 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 3330 Amorphous Polyalphaolefin (APAO) Modified Bitumen Roofing Grade.Description: Ethylene copolymer and FDA compliantFeatures: Balance temperature resistance and flexibilityApplications: Component of modified bitumen roofing systemsOth.. |
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Viscosity | 3000 - 6000 cP | 3000 - 6000 cP | |
3M Novec™ FC-4432 Fluorosurfactant 3M fluorosurfactant FC-4432 is a non-ionic polymeric fluorochemical surfactant that offers excellent wetting, leveling and flow control in a variety of waterborne, solvent-borne and high-solids orga.. |
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Viscosity | 3000 cP | 3000 cP | Nominal |
Dymax Light Weld® 429 High Clarity Glass Bonding Adhesive Glass Bonding in SecondsDescriptionDymax Light Weld® 400 Series adhesives form high-clarity, invisible bonds between glass and other substrates in seconds. In addition to many structural glass bond.. |
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Viscosity | 3000 cP | 3000 cP | Part B, RVT, #4, 2.5 rpm; TM R050-12 |
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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Viscosity | 3000 cP | 3000 cP | Mixed; TM R050-12 |
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |