Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 43.0 - 62.0 cm @Temperature 220 - 220 °C |
16.9 - 24.4 in @Temperature 428 - 428 °F |
Average value: 51.9 cm Grade Count:7 |
Overview of materials for Polystyrene, Heat Resistant Grade This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Heat Resistant Grade". Each property range of values reported is minimum and maximum values.. |
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Spiral Flow | 48.0 - 62.0 cm | 18.9 - 24.4 in | 177°C/1000 psi |
Cookson Group Plaskon® 3400F Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs .. |