Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 81.0 cm | 31.9 in | |
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i.. |
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Spiral Flow | 81.0 cm | 31.9 in | |
Cookson Group Plaskon® ULS-12LA Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and.. |